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Licensed Unlicensed Requires Authentication Published by De Gruyter August 1, 2010

A Study of Warpage and its Mechanism in Sequential Overmolding

  • S-C. Tseng, , K-J. Chang, and C-T. Huang,
From the journal Journal of Polymer Engineering
https://doi.org/10.1515/POLYENG.2010.30.3-4.189
Published Online: 2010-08

©2011 by Walter de Gruyter GmbH & Co.

From the journal
Journal of Polymer Engineering
Journal of Polymer Engineering
Volume 30 Issue 3-4
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Articles in the same Issue

CONTENTS
In Memoriam: Professor Tai Hun Kwon, 1952-2010
Electrospinning of Regenerated Silk Fibroin and Polyvinyl Alcohol blended Solution
Comparison of Analytical and Numerical Solutions for Simply Supported Composite Beams under Uniformly Distributed Loads
Classifications of Plastic Polymers based on Spectral Data Analysis with leaser induced Breakdown Spectroscopy
A Study of Warpage and its Mechanism in Sequential Overmolding
Study on Compatibilization of Polyethersulfone/poly (Aryl ether ketone) containing 1,4-Naphthalene blends
New Polyol for Production of Rigid Poliurethane-polyisocyanurate Foams Part 1: Characteristics and Conditions for the New Boroorganic Polyol Preparation
New Polyol for Production of Rigid Potyurethane-polyisocyanurate Foams Part 2: Preparation of Rigid Polyurethane-polyisocyanurate Foams with the New Polyol
The Prediction of Film Thickness after Transverse Stretching with a Consideration of Heated Air Flow in a Tenter
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