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Thin Film Encapsulation of Top-Emitting OLEDs using Atomic Layer Deposition

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Abstract

Multi-layer barriers prepared by atomic layer deposition are used to encapsulate organic light emitting diodes (OLEDs). This approach allows for both low water vapor transmission rates (5×10−7 g/(m2 day)) and outstanding chemical robustness. OLED lifetimes in excess of 20,000 h are achieved. For top-emitting OLEDs, the encapsulation layer concomitantly can be tailored to increase the external quantum efficiency by more than 40%. In addition, the prospects of ALD as encapsulation technique for the high volume production of organic electronic systems are discussed.

© 2010 Optical Society of America

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