Investigation on adhesive interface specimen deformation and failure process under tension using digital speckle correlation methodChinese Full Text
JIANG Ai-min;LI Gao-chun;GUO Yu;QIU Xin;WANG Yu-feng;Department of Aircraft Engineering,Naval Aeronautical and Astronautical University;The 41st Institute of the 6th Academy,China Aerospace Science and Industry Corporation;
Abstract: The deformation and failure process of adhesive interface specimen under tension was observed.By digital speckle correlation method（DSCM）to deal with images,displacement and strain field of speciman surface varying with load and their evolution process were achieved.The results show that during the tensile process the adhesive interface specimen with stress-release flap could be vulnerable crack at the tip of stress-release flap because of strain concentration.DSCM is an effective experimental method for studying characteristic of deformation and failure of adhesive interface specimen.The quantificational measurement results of adhesive interface deformation field are consistent with the data obtained from the experiment.
Keywords：
adhesive interface; digital speckle correlation method; deformation and failure; deformation field; solid rocket motor;
- DOI：
10.13224/j.cnki.jasp.2014.05.034
- Series：
- Subject：
- Classification Code：
V435
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