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摘要:
随着军用光电技术的快速发展，隐身技术在现代作战体系中的作用日趋重要，其中，隐身材料对于提高隐身性能至关重要。本文针对红外隐身材料，重点从单波段的红外隐身、多波段兼容的红外隐身、动态的红外隐身三方面综述了国内外红外隐身材料的研究进展，就微纳结构大面积柔性加工方法进行了深入分析。归纳了当前红外隐身材料存在的主要问题，并展望了未来发展趋势。未来，红外隐身材料将向着高强度、大面积、柔性化、智能化的新型结构和材料方向进一步发展，实现高性能的隐身功能。
Abstract:With the rapid development of military optoelectronic technology, the role of stealth technology in modern combat systems is becoming more and more important, among which, stealth materials are crucial to improve stealth performance. We focus on infrared stealth materials and review the research progress of domestic and foreign infrared stealth materials from three aspects including single-band infrared stealth, multi-band compatible infrared stealth, and dynamic infrared stealth, and provide an in-depth analysis on the large-area flexible processing methods for micro-nano structures. The main problems of current infrared stealth materials are summarized and the future development trend is foreseen. In the future, to achieve high-performance stealth functions, new infrared stealth materials will further develop in the direction of high strength, large area, flexibility, and intelligence.
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Key words:
- infrared stealth /
- metasurface /
- F-P cavity structure /
- photonic crystal /
- micro-nano fabrication
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Overview: With the rapid development of military optoelectronic technology, the role of stealth technology in modern combat systems is becoming more and more important, in which stealth materials are essential to improve stealth performance. Infrared stealth is to tune the infrared radiation signal characteristics of the target to become the smallest difference from the background. The target will be invisible in the background and can not be identified through the infrared imaging equipment.
Starting from the background of infrared stealth technology, we introduce the classification of stealth technology and the progress of domestic and foreign infrared stealth materials from three aspects including single-band infrared stealth, multi-band compatible infrared stealth, and dynamic infrared stealth, and provide an in-depth analysis on the large-area flexible processing methods for micro-nano structures. Compared with single-band infrared stealth, multi-band compatible infrared stealth based on the photonic crystal, Fabry-Perot cavity structure, and metasurface, dynamic infrared stealth has higher freedom of spectral modulation. With the development of advanced micro-nano processing technology, metasurface is expected to become the first choice for new infrared stealth in the future due to its ultra-high freedom spectral modulation, ultra-thin subwavelength structures, etc. In addition, we have conducted an in-depth analysis of flexible processing methods for large areas of micro and nano structures.
Finally, based on the summary and reflection of the research work, the development of new infrared stealth materials will be further prospected. 1) High-strength direction development. In some stealth material application scenarios such as aircraft, vehicles, tanks, and other weaponry, the material will function in extreme environments. Therefore, the new infrared stealth materials have good mechanical properties, high-temperature resistance, corrosion resistance, impact resistance, etc. 2) Large-area direction development. In actual applications, the target to be stealthy is from centimeter-level to meter-level applications, so a large area of new infrared stealth materials is the inevitable trend of future development. 3) Flexible direction development. No matter the stealth target is equipment parts or clothing wear, achieving conformal stealth is a key part of stealth material development. 4) Intelligent direction development. Due to the continuous development and integration of multi-band detection technology and the harsh requirements of the actual environment, the realization of real-time dynamic multi-band intelligent stealth is a major demand for stealth technology.
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图 2 基于温度调控的红外隐身研究。(a) 结构化热表面[12]；(b), (c) 虚拟目标的视觉混淆[13-14] ；(d) 隐身斗篷[15]；(e) 远红外单向隐身斗篷[16]；(f) 基于热绝缘材料的红外隐身[17]
Figure 2. Infrared stealth studies based on temperature modulation. (a) Structured thermal surfaces[12]; (b), (c) Visual obfuscation of virtual targets[13-14]; (d) Stealth cloak[15]; (e) Far-infrared unidirectional stealth cloak[16]; (f) Infrared stealth based on thermally insulating materials[17]
图 3 基于光子晶体结构的红外隐身研究。(a) Ge/ZnS光子晶体结构[21]；(b) Ge、ZnSe、Si光子晶体结构[22]；(c) SiO2、TiO2、Ge交替结构[23]；(d) Ge/ZnS光子晶体结构[24]；(e) 多光谱兼容光子晶体结构[25]
Figure 3. Infrared stealth research based on photonic crystal structures. (a) Ge/ZnS photonic crystals[21]; (b) Ge, ZnSe, Si photonic crystals[22]; (c) SiO2, TiO2, Ge alternating multilayer structures[23]; (d) Ge/ZnS photonic crystal structures[24]; (e) Multispectral compatible photonic crystal structures[25]
图 4 基于F-P腔结构的红外隐身研究。(a) Ag/Ge多层膜的红外隐身选择性发射器[27]；(b) 氧化铟锡透明导电膜和硫化锌介电膜复合四层结构[28] ；(c) 光刻胶和氧化铟锡四层交替结构[29]；(d) Si3N4-TiN-MgO-TiN四层结构[30]
Figure 4. Infrared stealth research based on F-P cavity structures. (a) Infrared stealth selective emitter with Ag/Ge multilayer films [27]; (b) Composite four-layer structure with transparent conductive films of indium tin oxide and dielectric films of zinc sulfide [28]; (c) Alternating four-layer structure with photoresist and indium tin oxide [29]; (d) Si3N4-TiN-MgO-TiN four-layer structures[30]
图 5 基于超构表面隐身材料的研究。(a) 超表面隐身地毯[53]；(b) 圆盘超表面[54]；(c) 圆环超表面[55]；(d) 兼容红外和微波隐身的分层超表面[56]；(e) 兼容可见光、红外、红外激光隐身的超表面[57]
Figure 5. Infrared stealth research based on metasurface structures. (a) Metasurface stealth carpet[53]; (b) Disc metasurface [54]; (c) Circular metasurface[55]; (d) Metasurface compatible with IR and microwave stealth[56]; (e) Metasurface compatible with visible, infrared, and laser stealth[57]
图 7 结合相变材料动态调控隐身材料应用实例。(a) VO2、石墨烯、碳纳米管三层结构隐身装置[77]；(b) 多层的空腔耦合的红外吸收器[78]；(c) 钨掺杂的二氧化钒的薄膜结构[79]；(d) GST-Au两层结构[80]
Figure 7. Examples of combined phase change materials for dynamic modulation of stealth materials applications. (a) VO2, graphene, and carbon nanotube trilayer structure stealth device[77]; (b) Multilayer cavity-coupled IR absorber[78]; (c) Thin film structure of tungsten-doped vanadium dioxide[79]; (d) GST-Au two-layer structure[80]
图 8 (a) 利用3D激光直写技术加工出的复杂图形；(b) 紫外连续变频光刻技术光路[89]；(c) EVG 770NT制备300 mm模板；(d) GL SR300300 mm大面积母模板[90]
Figure 8. (a) Complex pattern processed by 3D laser direct writing technology; (b) UV continuous frequency lithography optical path[89]; (c) 300 mm stencil prepared by EVG 770NT; (d) GL SR300300 mm large area master stencil[90]
图 9 纳米压印技术研究示例。(a) 步进闪光压印技术压印的宽度为100 nm的光栅[93]；(b) UV-SCIL平板压印[94]；(c) 晶圆级区域上实现亚10 nm的分辨率[95]
Figure 9. Examples of nanoimprinting technique studies. (a) Grating with a width of 100 nm embossed by step flash embossing technique[93]; (b) UV-SCIL plate embossing[94]; (c) Sub-10 nm resolution achieved on wafer-level area[95]
表 1 文献报道的超构表面结构面积和柔性对比
Table 1. Comparison of structural area and flexibility of metasurfaces in the reported literature
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