Textures and Microstructures
Volume 31 (1998), Issue 1-2, Pages 85-95
doi:10.1155/TSM.31.85
Abstract
Recently, some published experimental results have revealed that
springback of some common types of integrated circuit (IC) leadframes in roller forming is highly related to their anisotropic
properties. In this paper, a new plane stress bending model based
on the approach of Crystallographic Mechanics of Textured
Polycrystals (CMTP) has been developed to predict the deformation
behaviour and springback of a copper alloy. Based on the texture
data obtained from the measured orientation distribution function,
springback of the copper alloy in the rolling direction was
determined to be greater than that perpendicular to the rolling
direction. It was also found that the springback increased with
increasing die radius. The predictions were compared to the
experimental findings, and the trends of them were in reasonable
agreement.