Bird's Beak and Thermally Induced Stress Defects Evaluations of LOCOS Structures Fabricated Using ECR-CVD SiNx Without Pad Oxide

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© 2008 ECS - The Electrochemical Society
, , Citation Heraldo Scalise et al 2008 ECS Trans. 14 395 DOI 10.1149/1.2956054

1938-5862/14/1/395

Abstract

Silicon Nitrides were deposited on the silicon substrates by ECR-CVD (electron cyclotron resonance chemical vapor deposition), without using the pad oxide in LOCOS (LOCal Oxidation of Silicon) isolation technology. The SiNx/Si structure was used to substitute the SiNx/SiO2/Si. The study of this type of the structure was motivated by the possibility to reduce the length of the bird's beak. Defects were created on silicon because the high temperature (1000ºC) applied on SiNx/Si. The Dash wet chemical etch was used to etch the defect on silicon. Optical and SEM microscopy analysis were used to investigate the bird's beak in the obtained LOCOS structures and the defects (dislocations) on silicon performed after high temperature process.

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10.1149/1.2956054