Abstract
We have simulated silicon oxidation taking into account the emission of a large number of silicon atoms from the interface, which governs the silicon-oxidation rate. The silicon emission model enables the simulation to be done using the oxidant self-diffusivity in the oxide with a single activation energy. The simulation has deduced a silicon emission rate that exhibits a break point in its activation energy at around 1000°C, which is attributed to the viscoelastic properties of the oxide. Using a unified set of parameters, the whole range of oxide thickness is fitted in a wide range of oxidation temperatures (800–1200°C) without any empirical modifications.