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A study of GaAs: Si/GaAs: C tunnel diodes grown by MOCVD

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Abstract

Technological modes in which high-efficiency GaAs: Si/GaAs: C tunneling structures can be fabricated by MOS-hydride epitaxy have been determined. It was demonstrated that use of C and Si dopants makes it possible to obtain a p-n junction with low diffusion spreading of dopant profiles. It was shown that fabrication of high-efficiency tunnel diodes requires that GaAs layers should be doped with acceptor and donor impurities to a level of ∼9 × 1019 cm−3. Tunnel diodes were fabricated using the tunnel structures and their current-voltage characteristics were studied. Peak current densities J p ≈ 1.53 kA cm−2 and a differential resistance R ≈ 30 mΩ under a reverse bias were obtained in the tunnel diodes.

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Correspondence to D. A. Vinokurov.

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Original Russian Text © D.A. Vinokurov, M.A. Ladugin, A.A. Marmalyuk, A.A. Padalitsa, N.A. Pikhtin, V.A. Simakov, A.V. Sukharev, N.V. Fetisova, V.V. Shamakhov, I.S. Tarasov, 2009, published in Fizika i Tekhnika Poluprovodnikov, 2009, Vol. 43, No. 9, pp. 1253–1256.

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Vinokurov, D.A., Ladugin, M.A., Marmalyuk, A.A. et al. A study of GaAs: Si/GaAs: C tunnel diodes grown by MOCVD. Semiconductors 43, 1213–1216 (2009). https://doi.org/10.1134/S1063782609090206

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  • DOI: https://doi.org/10.1134/S1063782609090206

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