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Simulation of Heat Loads on the Surface of a Spacecraft in a Simulator with Grid Modules

  • HEAT AND MASS TRANSFER AND PHYSICAL GASDYNAMICS
  • Published:
High Temperature Aims and scope

Abstract

The results of studies related to the problem of creating an infrared simulator of a multimodule type for modeling heat loads on the surface of a spacecraft during their thermal vacuum testing are presented. It is shown that such a simulator can be created using mesh emitters as modules used in autonomous thermal vacuum tests of individual elements of a spacecraft with predominantly flat outer surfaces. This raises the problem of controlling a multimodule simulator, which consists in the need to determine such a nature of the distribution of electrical power supplied to individual modules, in which the calculated external heat loads on the surface of the test object would be reproduced with the highest possible accuracy for the simulation system under consideration. This problem is solved as an inverse problem of the theory of control of thermal processes. The results of computational experiments indicate the possibility of achieving high accuracy in modeling external heat loads on a spacecraft with a nonconcave outer surface.

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Funding

The work was carried out within the framework of a state assignment of the Ministry of Science and Higher Education of the Russian Federation, code FSFF-2020-0016.

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Authors and Affiliations

  1. Moscow Aviation Institute (National Research University), 125993, Moscow, Russia

    A. V. Kolesnikov, A. V. Paleshkin & P. F. Pronina

  2. JSC NPO Lavochkin, 141140, Khimki, Russia

    E. V. Shemetova

Authors
  1. A. V. Kolesnikov
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  2. A. V. Paleshkin
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  3. P. F. Pronina
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  4. E. V. Shemetova
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Corresponding authors

Correspondence to A. V. Paleshkin or E. V. Shemetova.

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The authors declare that they have no conflicts of interest.

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Kolesnikov, A.V., Paleshkin, A.V., Pronina, P.F. et al. Simulation of Heat Loads on the Surface of a Spacecraft in a Simulator with Grid Modules. High Temp 60, 215–221 (2022). https://doi.org/10.1134/S0018151X22020250

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  • DOI: https://doi.org/10.1134/S0018151X22020250

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