Paper
30 January 1990 Statistical Methodology For The Evaluation, Characterization And Optimization Of Dry Etch Modules
Richard O. Lynch, Richard J. Markle
Author Affiliations +
Proceedings Volume 1185, Dry Processing for Submicrometer Lithography; (1990) https://doi.org/10.1117/12.978059
Event: 1989 Microelectronic Integrated Processing Conferences, 1989, Santa Clara, United States
Abstract
Accelerated learning, improved process control and advanced manufacturability are high priorities at SEMATECH. This being the case, the effective use of such statistical techniques as the design of experiments, response surface methodology and statistical process control are also high priorities. We have developed and are using a generic module evaluation, characterization and optimization methodology that integrates the use of these statistical tools to accelerate and improve both the accomplishment of these tasks and that of climbing the learning curves for both the processing tool and its process. In this paper we describe an important portion of this methodology, Passive Data Collection. We will illustrate Passive Data Collection in dry etching with an example.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard O. Lynch and Richard J. Markle "Statistical Methodology For The Evaluation, Characterization And Optimization Of Dry Etch Modules", Proc. SPIE 1185, Dry Processing for Submicrometer Lithography, (30 January 1990); https://doi.org/10.1117/12.978059
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Etching

Lithography

Semiconducting wafers

Statistical analysis

Process control

Dry etching

Optimization (mathematics)

Back to Top