Future Capabilities Of Z-Plane Technology

Myles F. Suer; John C. Carson

doi:10.1117/12.960368

13 September 1989 Future Capabilities Of Z-Plane Technology

Myles F. Suer, John C. Carson

Proceedings Volume 1097, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array; (1989) https://doi.org/10.1117/12.960368
Event: SPIE 1989 Technical Symposium on Aerospace Sensing, 1989, Orlando, FL, United States

Abstract

Z-plane electronics packaging technology was initially developed to provide real estate for advanced analog signal processing infrared circuitry for focal plane applications. This paper will discuss the relevant qualities of Z-technology, review forecasting technology methodologies, and develop conclusions regarding the future of 3-dimensional electronics--both analog and digital.

Citation Download Citation

Myles F. Suer and John C. Carson "Future Capabilities Of Z-Plane Technology", Proc. SPIE 1097, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array, (13 September 1989); https://doi.org/10.1117/12.960368

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