High Resolution IR Thermal Imaging For Electronic Inspection

E. E. Anderson; P. S. Castro

doi:10.1117/12.954457

20 January 1976 High Resolution IR Thermal Imaging For Electronic Inspection

E. E. Anderson, P. S. Castro

Proceedings Volume 0062, Modern Utilization of Infrared Technology I; (1976) https://doi.org/10.1117/12.954457
Event: 19th Annual Technical Symposium, 1975, San Diego, United States

Abstract

Advances in technology have brought about IR thermal imaging systems with faster scan times and higher spatial resolution. This is in part due to the use of the mercury cadmium telluride (HgCdTe) detector which provides system performance advantages in evaluating temperatures up to 200°C. High spatial resolution permits the detection of thermal gradients in small electronic components and can reveal small voids and defects in materials. Thermal profiling of electronic circuit boards can be used for design evaluation and production testing. Effective use of this technique should take into consideration variations in emissivity of the material being studied. Examples of how to correct or compensate for these emissivity variations will be presented. Detection of voids and flaws in materials often requires the application of heat or cold to the material being investigated. This produces a surface thermal gradient which depicts the underlying abnormality. Approaches to the use of this technique in void detection will be presented.

Citation Download Citation

E. E. Anderson and P. S. Castro "High Resolution IR Thermal Imaging For Electronic Inspection", Proc. SPIE 0062, Modern Utilization of Infrared Technology I, (20 January 1976); https://doi.org/10.1117/12.954457

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