Paper
6 May 2009 Novel readout circuit architecture realizing TEC-less operation for SOI diode uncooled IRFPA
Takahiro Ohnakado, Masashi Ueno, Yasuaki Ohta, Yasuhiro Kosasayama, Hisatoshi Hata, Takaki Sugino, Takanori Ohno, Keisuke Kama, Masahiro Tsugai, Hiroshi Fukumoto
Author Affiliations +
Abstract
We have developed a novel readout circuit architecture realizing a TEC-less (Thermo-Electric Cooler) operation for an SOI diode uncooled infrared focal plane array (IRFPA). Through the fabrication of an SOI diode uncooled 320 x 240 IRFPA adopting the readout circuit architecture with our existing 25μm pixel-pitch technology, we demonstrate that the variation of the output DC level of the pixels is successfully suppressed in environmental temperatures from -10°C to 50°C. The developed TEC-less technology greatly enhances the ability of the SOI diode uncooled IRFPA, which inherently possesses excellent uniformity and low noise features.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takahiro Ohnakado, Masashi Ueno, Yasuaki Ohta, Yasuhiro Kosasayama, Hisatoshi Hata, Takaki Sugino, Takanori Ohno, Keisuke Kama, Masahiro Tsugai, and Hiroshi Fukumoto "Novel readout circuit architecture realizing TEC-less operation for SOI diode uncooled IRFPA", Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980V (6 May 2009); https://doi.org/10.1117/12.818418
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Cited by 8 scholarly publications.
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KEYWORDS
Diodes

Temperature metrology

Temperature sensors

Reflectors

Infrared cameras

Infrared radiation

Integrated circuit design

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