1TRIZ Ctr. Tvortchestvo Ltd. Co. (Russia) 2Moscow Academy of Food Production (Russia) 3St. Petersburg State Univ. of Information Technologies Mechanics & Optics (Russia)
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The phenomenological model of laser joining at so called boundary kitetic is developed. The criteria of microjoints strength is suggested. As a result of kinetics of computer simulation of soldered joints forming, practical investigations of soldering modes influence at the joints strength and analysis of micro section metallographic specimens fulfilled with the aid of electronic microscope, the possibility of two-three fold enhancement of soldered joints strength in comparison with manual soldering. Technological process and automated equipment are developed for laser soldering of electronic components with planar leads at the printed circuit boards.
Alexander Allas,Victor Novosadov, andVadim Veiko
"Optimization of laser microsoldering and microwelding processes by modeling of joints kinetics formation", Proc. SPIE 6107, Laser-based Micropackaging, 610707 (1 March 2006); https://doi.org/10.1117/12.643767
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Alexander Allas, Victor Novosadov, Vadim Veiko, "Optimization of laser microsoldering and microwelding processes by modeling of joints kinetics formation," Proc. SPIE 6107, Laser-based Micropackaging, 610707 (1 March 2006); https://doi.org/10.1117/12.643767