Improved efficiency for processing transparent materials by using double-pulse explosion drilling

Asato Tamura; Takuei Nishio; Hiroyuki Suhara; Norio Nagayama

doi:10.1117/12.2508116

22 March 2019 Improved efficiency for processing transparent materials by using double-pulse explosion drilling

Asato Tamura, Takuei Nishio, Hiroyuki Suhara, Norio Nagayama

Proceedings Volume 10906, Laser-based Micro- and Nanoprocessing XIII; 109061N (2019) https://doi.org/10.1117/12.2508116
Event: SPIE LASE, 2019, San Francisco, California, United States

Abstract

Recent years have seen an increase in the demand of laser processing of transparent materials because of the numerous applications, such as the formation of through-silicon vias, glass scribing, the creation of optical wave guides, and so on. Furthermore, laser processing is expected to be used for fabricating photonic devices and circuits. Although significant research efforts have focused on laser processing of transparent materials, many unexplained mechanisms remain to be elucidated. In particular, mechanisms that remain unclear include plasma absorption and the process whereby traces expand when using double pulses. In 2017, to improve the laser-processing speed and efficiency, we proposed a method for cutting transparent materials called the “double-pulse explosion drilling method,” which uses two laser pulses of differing wavelengths to create internal modifications in a material. In the present study, we use the double-pulse method to drill through transparent materials and investigate how the second pulse affects laser-beam absorption and the generation of processing traces. We used a picosecond laser with pulses at 532 and 1064 nm for the first and second pulse, respectively. The target material was fused silica glass. The results clarify how the use of double pulses improves the processing efficiency. This presentation gives the experimental results and discusses the processing mechanisms at work in the double-pulse method.

Citation Download Citation

Asato Tamura, Takuei Nishio, Hiroyuki Suhara, and Norio Nagayama "Improved efficiency for processing transparent materials by using double-pulse explosion drilling", Proc. SPIE 10906, Laser-based Micro- and Nanoprocessing XIII, 109061N (22 March 2019); https://doi.org/10.1117/12.2508116

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available