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Mass transport characteristics in a pulsed plasma enhanced chemical vapor deposition reactor for thin polymer film deposition
Goyal, K.O.; Mahalingam, R.; Pedrow, P.D.; Osman, M.A.;
Plasma Science, IEEE Transactions on
Volume 29,
Issue 1,
Feb 2001
Page(s):42
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50
Abstract:
A pulsed plasma enhanced chemical vapor deposition (PECVD) reactor is used for the preparation of thin polyacetylene films. A theoretical model based on the mass transport characteristics of the reactor is developed in order to correlate with experimentally obtained spatial deposition profiles for the acetylene plasma polymer film deposited within the cylindrical reactor. Utilizing a free radical mechanism with gas phase initiation of the polymerization reaction as the rate controlling step, a system parametric study is performed to predict the Peclet number range of operation for the pulsed PECVD reactor. This parametric study indicates radical decay by diffusion to the reactor walls to be the significant physical phenomenon in the system. It is concluded that a quasi-steady-state model is a good tool for predicting the important mass transfer phenomena occurring in the pulsed plasma reactor
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