High speed, 100 percent solder paste inspection

High speed, 100 percent solder paste inspection

Keywords CyberOptics, Solder paste, Inspection

CyberOptics has announced the debut of the SE 300 high-speed, high-resolution 3D solder paste inspection system (Plate 4). The SE 300 is capable of performing 100 percent inspection at production line speeds, yet it is priced 20 percent lower than equivalent systems.

Plate 4 The SE 300 3D solder paste inspection system from CyberOptics

The SE 300 automatically measures height, volume, area and bridging and notifies the operator if any parameters begin trending outside the user-specified limits. Measurement repeatability and reproducibility meet the strictest standards, with gage R&R for QFPs, BGAs and CSPs less than 10 percent of typical process tolerances.

For maximum flexibility, the user has a choice of two operating modes. High-speed mode, designed for fine-pitch QFPs and other traditional components, inspects 4.5sq. in/sec (29sq. cm/sec). High-resolution mode, used for inspecting newer, smaller components such as CSPs and 0402 discretes, inspects at 1.5sq. in/sec (9.7sq. cm/sec). For optimum results beth speeds can be combined in the same inspection program.

The system SE 300 consists of a one meter wide machine designed to replace a section of standard conveyor in front of the chip-shooter feeders. The built-in, adjustable conveyor transports boards up to 18 x 20in. (457 x 508mm) and secures them for inspection. For maximum stability and minimal vibration, the machine rests on a heavy cast polymer base. The keybeard and flat panel display are ergonomically designed so the user can adjust height and position as needed.

Programming can be performed off-line if desired. Software is available for Gerber input programming and for SPC (statistical process control). Other options include a NIST-certified calibration standard for self-certification.

For further information, please contact: +1 (763) 542 5000 or visit www.cyberoptics.com