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Wire Bonding as a Technique for Semiconductor Device Assembly

A.D. Weston (Holbury, Southampton, England)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 March 1985

84

Abstract

This paper is aimed at Engineers involved in production wire‐bonding processes and system maintenance. It traces the development of microbonding from its origins to the present day. Principles and techniques are examined and some approaches to fault diagnosis are explored.

Citation

Weston, A.D. (1985), "Wire Bonding as a Technique for Semiconductor Device Assembly", Microelectronics International, Vol. 2 No. 3, pp. 26-35. https://doi.org/10.1108/eb044183

Publisher

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MCB UP Ltd

Copyright © 1985, MCB UP Limited

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