Wire Bonding as a Technique for Semiconductor Device Assembly
A.D. Weston
(Holbury, Southampton, England)
84
Abstract
This paper is aimed at Engineers involved in production wire‐bonding processes and system maintenance. It traces the development of microbonding from its origins to the present day. Principles and techniques are examined and some approaches to fault diagnosis are explored.
Citation
Weston, A.D. (1985), "Wire Bonding as a Technique for Semiconductor Device Assembly", Microelectronics International, Vol. 2 No. 3, pp. 26-35. https://doi.org/10.1108/eb044183
Publisher
:MCB UP Ltd
Copyright © 1985, MCB UP Limited