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Dynamic fuse model for electromigration failure of polycrystalline metal films

R. Mark Bradley and Kang Wu
Phys. Rev. E 50, R631(R) – Published 1 August 1994
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Abstract

We introduce a dynamic fuse model for the damage done to a current-carrying polycrystalline metal film by electromigration. For all initial densities of defects p, the mean failure time 〈Tf〉 is, to an excellent approximation, proportional to the average length of the shortest path across the film in a certain metric. 〈Tf〉 tends to zero as (pc-p)4/3 as the percolation threshold p=pc is approached.

    DOI:https://doi.org/10.1103/PhysRevE.50.R631

    ©1994 American Physical Society

    Authors & Affiliations

    R. Mark Bradley and Kang Wu

    • Department of Physics, Colorado State University, Fort Collins, Colorado 80523

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    Vol. 50, Iss. 2 — August 1994

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