Tc degradation in cuprate superconductors from the resistivity of YBa2(Cu1xMx)4O8 for M=Fe and Ni

Ratan Lal, V. P. S. Awana, S. P. Pandey, V. S. Yadav, Deepak Varandani, A. V. Narlikar, Anjli Chhikara, and E. Gmelin
Phys. Rev. B 51, 539 – Published 1 January 1995
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Abstract

Systematic measurements of the resistivity of the polycrystalline samples of the YBa2(Cu1xMx)4O8 system with M=Fe, Ni are reported. The resistivity behavior depends strongly on the dopant concentration. For the Fe 6-at. % sample, there is no metallic behavior in the resistivity, but for T>50 K, the resistivity decreases very slowly with temperature. The behavior of the resistivity of the Fe 10-at. % and Ni 5-at. % samples is analyzed, and it is found that the variable-range hopping process may occur in these samples below about 30 K. While the Ni 5-at. % sample is found to show signs of the nearest-neighbor hopping process of conductivity above about 150 K, the Fe 10-at. % sample does not show such behavior up to 300 K. On this basis it is found that localization may not be a possible reason of the large Tc depression in the YBa2(Cu1xMx)4O8 system by the Fe and Ni dopants. We have examined the possibility of Tc degradation due to carrier-impurity potential scattering also by using a single-crystal analog of the polycrystalline sample. This analogy is justified to within a factor of less than 1.33. On the basis of this analogy we have found that potential scattering may not be a reasonable source of Tc degradation in the Ni- and Fe-doped samples of the system considered.

  • Received 12 August 1994

DOI:https://doi.org/10.1103/PhysRevB.51.539

©1995 American Physical Society

Authors & Affiliations

Ratan Lal, V. P. S. Awana, S. P. Pandey, V. S. Yadav, Deepak Varandani, and A. V. Narlikar

  • National Physical Laboratory, K.S. Krishnan Road, New Delhi 110012, India

Anjli Chhikara

  • Department of Physics, Goa University, Goa, India

E. Gmelin

  • Max-Planck-Institut für Festkörperforschung, Heisenbergstrasse 1, D-70569, Stuttgart, Germany

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Vol. 51, Iss. 1 — 1 January 1995

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