Metal/GaP(110) interface formation: Ti, Pd, Ag, and Au adatom deposition

B. M. Trafas, F. Xu, M. Vos, C. M. Aldao, and J. H. Weaver
Phys. Rev. B 40, 4022 – Published 15 August 1989
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Abstract

The evolution on interfaces formed at 300 K by the deposition of atoms of Ti, Pd, Ag, and Au on cleaved GaP(110) has been studied using synchrotron-radiation photoemission. For Ti, Pd, and Au, metal deposition induces immediate disruption of the substrate and atomic intermixing. In contrast, Ag deposition at 300 K onto GaP(110) leads to cluster formation, and there is no observable surface disruption. Comparison of these results for atom condensation on GaP(110) to those for GaAs(110) and InP(110) indicates that the Ga and P redistribution and the formation of reaction products is indistinguishable, regardless of the particular semiconductor substrate.

  • Received 17 April 1989

DOI:https://doi.org/10.1103/PhysRevB.40.4022

©1989 American Physical Society

Authors & Affiliations

B. M. Trafas, F. Xu, M. Vos, C. M. Aldao, and J. H. Weaver

  • Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota 55455

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Vol. 40, Iss. 6 — 15 August 1989

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