Effect of oxygen gas pressure on the kinetics of alumina film growth during the oxidation of Al(111) at room temperature

Na Cai, Guangwen Zhou, Kathrin Müller, and David E. Starr
Phys. Rev. B 84, 125445 – Published 29 September 2011

Abstract

We have studied the effect of oxygen pressure on the self-limiting oxidation of an Al(111) surface at room temperature for oxygen pressures from 1×108 to 5 Torr. Using x-ray photoelectron spectroscopy measurements, we monitor the oxidation kinetics and the oxide film thickness for different oxidation times and pressures. After a rapid initial growth stage, the oxide film reaches a saturated thickness, which depends on the oxygen pressure. The kinetic potential, oxide growth rate, oxide film limiting thickness, and the density of oxygen anions on the oxide surface are determined by the measured oxidation kinetics. These quantities show a Langmuir isotherm dependence on the oxygen gas pressure.

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  • Received 14 July 2011

DOI:https://doi.org/10.1103/PhysRevB.84.125445

©2011 American Physical Society

Authors & Affiliations

Na Cai and Guangwen Zhou*

  • Department of Mechanical Engineering and Multidisciplinary Program in Materials Science and Engineering, State University of New York, Binghamton, New York 13902, USA

Kathrin Müller and David E. Starr

  • Center for Functional Nanomaterials, Brookhaven National Laboratory, Upton, New York 11973, USA

  • *Corresponding author: gzhou@binghamton.edu

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Vol. 84, Iss. 12 — 15 September 2011

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