Interdiffusion and chemical trapping at InP(110) interfaces with Au, Al, Ni, Cu, and Ti

Yoram Shapira, L. J. Brillson, A. D. Katnani, and G. Margaritondo
Phys. Rev. B 30, 4586 – Published 15 October 1984
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Abstract

We have studied UHV-cleaved (110) surfaces of InP covered with a large variety of metal layers and interlayers, using Auger-electron spectroscopy in conjunction with Ar+-ion sputtering. All measurements were made under identical experimental conditions, other than the thickness or type of the metal films, in order to minimize ion-beam-induced distortion of the data. We find that In and especially P are segregated at unreactive metal surfaces such as Au or Cu. Very thin interlayers of "reactive" metals between Au and InP completely reverse the out-diffused distribution of the phosphorus, which is accumulated at the interface due to chemical trapping by the reactive-metal interlayers. Indium out-diffusion is found to be unaffected by these interlayers while Au in-diffusion depends sensitively on the type of metal interlayer. The results are correlated with soft-x-ray photoemission spectroscopy (SXPS) measurements to reveal the diffusant spatial distribution on a microscopic scale while illustrating the relative limitations of the SXPS technique. The contrasting effects of the unreactive versus reactive-metal interfaces are correlated with Schottky-barrier heights and with energy-level calculations of associated surface defects.

  • Received 15 March 1984

DOI:https://doi.org/10.1103/PhysRevB.30.4586

©1984 American Physical Society

Authors & Affiliations

Yoram Shapira* and L. J. Brillson

  • Xerox Webster Research Center, Webster, New York 14580

A. D. Katnani and G. Margaritondo

  • Physics Department, University of Wisconsin—Madison, Madison, Wisconsin 53706

  • *On sabbatical leave from the Faculty of Engineering, Tel-Aviv University, Ramat Aviv 69978, Israel

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Vol. 30, Iss. 8 — 15 October 1984

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