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IEICE Transactions on Electronics 2006 E89-C(1):9-15; doi:10.1093/ietele/e89-c.1.9
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Copyright © 2006 The Institute of Electronics, Information and Communication Engineers

Special Section on Near-Field and Far-Field Electromagnetic Absorption and Shielding and Related Technologies -- Papers

Near-Field Magnetic Measurements and Their Application to EMC of Digital Equipment

Takashi HARADA1, Norio MASUDA1 and Masahiro YAMAGUCHI2

1 The authors are with Jisso and Production Technologies Research Laboratories, NEC Corporation, Sagamihara-shi, 229-1198 Japan. E-mail: t-harada{at}bl.jp.nec.com, 2 The author is with Tohoku University, Sendai-shi, 980-8579 Japan.

Techniques of near-field magnetic measurement and their applications to EMC of digital equipment are described. Magnetic-field measurement near PCB or LSI is the mostly used technique to specify the source. This paper treats an example of board analysis by near-field magnetic measurement, the sensing mechanism and the structure of a loop probe, and a recent progress of this method and application. To establish appropriate design direction in high-speed and high-density packaging of electronic equipment, electromagnetic behavior in chip and package should be clarified. Expectation of development for measuring minute area is more and more increasing.

Key Words: near field, electromagnetic compatibility, loop probe, printed circuit board, package

Manuscript received August 29, 2005. Manuscript revised September 17, 2005.


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