Abstract
An electromechanical device is described whereby monolayers from two different air/water interfaces may be transferred to solid supports and assembled into large and complex arrays. Any desired number of layers from each monolayer system may be incorporated into the final assembly, in any arbitrary sequence of deposition, as dictated by a predetermined program sequence. A significant saving in time and a reduction of operator involvement is achieved during the preparation of complex multilayer assemblies, since operation and execution of dipping sequences is fully automatic. Monolayers are transferred to solid supports at a uniform and constant rate and not sinusoidally with time, as in some previously described arrangements. The optimum utilisation of work cycle results in further efficiency. The electronic systems used in programming, control and counting are greatly simplified by the use of contemporary integrated circuit elements.