* Corresponding authors

^a Tianjin Key Laboratory of Wireless Mobile Communications and Power Transmission, College of Electronic and Communication Engineering, Tianjin Normal University, Tianjin 300387, China
E-mail: cwang@tjnu.edu.cn

^b Department of Intelligence Science and Technology, College of Artificial Intelligence, Tianjin Normal University, Tianjin 300387, China

^c Department of Communication Engineering, College of Electronic and Communication Engineering, Tianjin Normal University, Tianjin 300387, China

^d Center for Theoretical Physics, Hainan University, Haikou 570228, China
E-mail: wxy@hainanu.edu.cn

^e Department of Physics, School of Physical Science and Optoelectrical Engineering, Hainan University, Haikou 570228, China

^f Industrialization Center of Micro/Nano ICs and Devices, Sino-German College of Intelligent Manufacturing, Shenzhen Technology University, Shenzhen 518118, China
E-mail: jiayuan@sztu.edu.cn, zhangzhixing@sztu.edu.cn