Issue 43, 2021, Issue in Progress
From the journal:

RSC Advances

In situ fabrication of silver/polyimide composite films with enhanced heat dissipation

So Yoon Lee,a   Tae-Hwan Huh,b   Hye Rim Jeongb  and  Young-Je Kwark ORCID logo *b  

* Corresponding authors

a Department of Information Communication, Materials Engineering, Chemistry Convergence Technology, Soongsil University, Seoul, Republic of Korea

b Department of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea
E-mail: ykwark@ssu.ac.kr

Abstract

In this study, silver/polyimide (Ag/PI) composite films with enhanced heat dissipation properties were prepared. Ag was formed in situ by reducing AgNO3 at various locations according to the reduction method. Two different types of soluble PIs capable of solution processing were used, namely Matrimid and hydroxy polyimide (HPI). Unlike Matrimid with bulky substituents, HPI with polar hydroxy groups formed ion–dipole interactions with Ag ions to form Ag particles with uniform size distribution. The location and distribution of Ag particles affect the heat emission characteristics of the composite films, resulting in better heat dissipation properties with the thermally and photochemically reduced Ag/HPI films having more Ag particles distributed inside of the films than the chemically reduced films.

Graphical abstract: In situ fabrication of silver/polyimide composite films with enhanced heat dissipation

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Article information

DOI
https://doi.org/10.1039/D1RA02380B
Article type
Paper
Submitted
25 Mar 2021
Accepted
16 Jul 2021
First published
03 Aug 2021
This article is Open Access
Creative Commons BY-NC license

RSC Adv., 2021,11, 26546-26553

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In situ fabrication of silver/polyimide composite films with enhanced heat dissipation

S. Y. Lee, T. Huh, H. R. Jeong and Y. Kwark, RSC Adv., 2021, 11, 26546 DOI: 10.1039/D1RA02380B

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