SCHEDULED MAINTENANCE
Micro heat pipe device utilizing extended nanofluidics†
*a
Yutaka
Kazoe,
b
Kyojiro
Morikawa,
b
Hisashi
Shimizu,
b
Yuriy
Pihosh,
b
Kazuma
Mawatari
b
and
Takehiko
Kitamori
*b
Abstract
The next-generation cooling devices are gradually being scaled to smaller than the size of high-performance microchips to enable local heat removal from small hot spots. Realization of a micro/nanofluidic heat pipe device is a challenging task, as it requires high condensation efficiency in an ultra-small space and sufficient liquid transport without employing any wick. Herein, we demonstrate a two-phase loop micro heat pipe device based on unique liquid properties in extended nanospace (10–1000 nm) to meet the growing demands of the miniaturization of electronics and optoelectronics. The device, which contains a small volume of liquid (tens of nanoliter) and does not require a wick, can be conveniently embedded in the microchip. The capillary condensation of water on nanopillars was investigated. The experimental results showed a significant enhancement of the condensation rate on nanopillars for a faster vapor–liquid phase transition. In addition, a streaming potential measurement was performed to evaluate the liquid transport during operation of the micro heat pipe device. This method enables the measurement of water flow rates through extended nanochannels without requiring probe molecules. The micro heat pipe device was verified to work properly. Finally, the cooling performance of the micro heat pipe device was quantitatively estimated, and improvements were proposed to achieve highly efficient cooling.
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