Issue 16, 2015

Robust Ag nanoplate ink for flexible electronics packaging

Abstract

Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformations observed in failure microcracks with the formation of PVP nanofibers, revealed bonding strength at low temperatures (<250 °C) was primarily due to adhesive bonding. It is found that, utilizing photonic sintering, ∼70 °C reduction of transformation temperature from adhesive to metallic bonding was achieved compared to that of thermal sintering. A numerical simulation was developed to better understand the influences of the light-induced heat generation, which demonstrated near-infrared light can facilitate sintering. Bonding strengths of 27 MPa were achieved at room temperatures, and 29.4 MPa at 210 °C with photonic sintering. Moreover, the anisotropic resistivity was observed with different thermal dependences. These results demonstrate Ag nanoplate inks have potential for low temperature 3D interconnections in lead-free microcircuits, flexible electronic packaging, and diverse sensing applications.

Graphical abstract: Robust Ag nanoplate ink for flexible electronics packaging

Supplementary files

Article information

Article type
Paper
Submitted
15 Jan 2015
Accepted
23 Mar 2015
First published
24 Mar 2015

Nanoscale, 2015,7, 7368-7377

Author version available

Robust Ag nanoplate ink for flexible electronics packaging

R. Li, A. Hu, D. Bridges, T. Zhang, K. D. Oakes, R. Peng, U. Tumuluri, Z. Wu and Z. Feng, Nanoscale, 2015, 7, 7368 DOI: 10.1039/C5NR00312A

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