Issue 5, 2015

Characterisation of the thermal self-healing of a high crosslink density epoxy thermoset

Abstract

A new self-healing thermosetting epoxy polymer with high cross-linked density was prepared using a diamine cross-linker with two Diels–Alder (DA) units and tri-functional triglycidyl p-amino phenol (TGAP). The curing and self-healing conditions of the TGAP-based epoxy polymer were examined. Under suitable conditions, the self-healing properties of the highly cross-linked polymer were studied via DMA and swelling tests. The different properties of TGAP-based self-healing epoxy polymers were compared to previously-reported lower crosslink density self-healing epoxy polymers and the influence of the crosslink density is discussed.

Graphical abstract: Characterisation of the thermal self-healing of a high crosslink density epoxy thermoset

Article information

Article type
Paper
Submitted
09 Jan 2015
Accepted
15 Feb 2015
First published
16 Feb 2015

New J. Chem., 2015,39, 3497-3506

Author version available

Characterisation of the thermal self-healing of a high crosslink density epoxy thermoset

N. Bai, G. P. Simon and K. Saito, New J. Chem., 2015, 39, 3497 DOI: 10.1039/C5NJ00066A

To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements