Issue 11, 2013
From the journal:

Journal of Materials Chemistry A

Surface protection of copper by self-assembly of novel poly(5-methylenebenzotriazol-N-yl)†

Yu Ming Lee,a   Ying Hsueh Chang Chien,c   Man-kit Leung,*ab   Chi-Chang Huc  and  Chi-Chao Wanc  

* Corresponding authors

a Department of Chemistry, National Taiwan University, Taipei 106, Taiwan
E-mail: mkleung@ntu.edu.tw

b Institute of Polymer Science and Engineering, National Taiwan University, Taipei 106, Taiwan

c Department of Chemical Engineering, National Tsing-Hua University, Hsinchu 300, Taiwan

Abstract

The novel polymer poly(5-methylenebenzotriazol-N-yl), denoted BTA-poly, was investigated for the protection of copper by electrochemical studies and weight loss measurements. The electrochemical measurements were compared to weight loss measurements and satisfactory results were obtained. Compared with benzotriazole, which is one of the best corrosion inhibitors for copper, BTA-poly achieves good protection under the same test conditions. Due to the rapid adsorption of BTA-poly onto copper, its corrosion-inhibition efficiency can be controlled by varying the concentration. The protecting effects of the polymers were studied in a sodium chloride solution using electrochemical measurements and an immersion test. The surface characteristics of the polymer-modified copper were analyzed via X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM). These results show that BTA-poly can be easily adsorbed onto the copper surface via self-assembly to achieve excellent anticorrosion/antioxidation effects.

Graphical abstract: Surface protection of copper by self-assembly of novel poly(5-methylenebenzotriazol-N-yl)

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Article information

DOI
https://doi.org/10.1039/C3TA01250F
Article type
Paper
Submitted
26 Nov 2012
Accepted
09 Jan 2013
First published
09 Jan 2013

J. Mater. Chem. A, 2013,1, 3629-3638

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Surface protection of copper by self-assembly of novel poly(5-methylenebenzotriazol-N-yl)

Y. M. Lee, Y. H. Chang Chien, M. Leung, C. Hu and C. Wan, J. Mater. Chem. A, 2013, 1, 3629 DOI: 10.1039/C3TA01250F

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