Thickness and Interfacial Roughness Changes in Polymer Thin Films during X-Irradiation

Andrew G. Richter,*§ Rodney Guico, Ken Shull, and Jin Wang
Advanced Photon Source, Argonne National Laboratory, Argonne, Illinois 60439, and Department of Materials Science, Northwestern University, Evanston, Illinois 60208
Macromolecules, 2006, 39 (4), pp 1545–1553
DOI: 10.1021/ma050060v
Publication Date (Web): January 27, 2006
Copyright © 2006 American Chemical Society
*

 Corresponding author. E-mail:  Andrew.Richter@valpo.edu.

 Argonne National Laboratory.

§

 Present address:  Department of Physics and Astronomy, Valparaiso University, Valparaiso, IN 46393.

 Northwestern University.

Abstract

Despite the obvious occurrence of synchrotron X-ray damage to organic thin films, few attempts have been made to qualitatively determine changes to their structural parameters during X-ray exposure. We report here the use of X-ray reflectivity to study X-radiation damage to thin films of poly(tert-butyl acrylate) and polystyrene at various incident flux densities and sample temperatures. At the flux densities studied, (0.4−6.7) × 109 photons/(s mm2), the polyacrylate film thickness decreased during irradiation at rates ranging from −0.1 to −4 Å/min, while the surface roughness increased. The volume of polymer removed per incident photon ranged from 150 to 1400 Å3/photon. The rate of the thickness decay of the films was found to be linear with flux density over the range studied. The damage rate also appears to be directly related to the amount of X-ray energy deposited in the film, not the amount of energy available for creation of secondary electrons at the substrate. At comparable flux densities, polystyrene films heated above the glass transition temperature were found to behave similarly to the polyacrylate films, losing between 40 and 250 Å3/photon; however, at room temperature polystyrene films instead slightly increased in thickness.

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History

  • Published In Issue February 21, 2006
  • Received January 11, 2005
    Revised Manuscript Received December 21, 2005

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