Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
Fabrication of smooth silicon optical devices using proton beam writing
Introduction
For many years, achieving lasing and optical modulation in silicon has been a challenge for scientists due to its indirect bandgap and weak electro-optical properties. Recently, several breakthroughs have been made in the development of silicon-based device and technology. Intel has demonstrated the first continuous-wave silicon laser using stimulated Raman emission [1]. It is not much later that they demonstrated the first 40 Gbps optical modulator, which uses free carrier injection to modulate light signals [2].
This paper gives a brief review of a newly developed technique that utilizes ion beam irradiation and electrochemical etching for the fabrication of smooth low loss photonic devices in bulk silicon. Previously, three-dimensional microstructures have been successfully demonstrated using this process [3], [4], [5]. In order to extend this technique to waveguide and optical devices fabrication, we have devised two ways of achieving optical isolation from the substrate. In the first approach, the structure is undercut by prolonged etching so that it becomes surrounded by porous silicon cladding [6]. The second approach uses double energy irradiation to create a free-standing waveguide with air cladding [7]. Surface roughness plays an important role in affecting the quality of the optical devices. We demonstrate that performing a post-oxidation smoothening process enables us to achieve smooth surfaces of less than 3 nm. Other factors such as ion fluence and scanning parameters are also shown to affect the surface roughness and propagation loss.
Section snippets
Channel or strip waveguides
Waveguides are the main building block for a silicon-based photonics circuit. Most conventional waveguides are built on silicon-on-insulator (SOI) substrate formed by separation by implantation of oxygen (SIMOX). Due to the high-index-contrast between Si and SiO2, ultracompact devices with small bending radius can be formed. SOI substrate also offers a compatible platform for Si photonics to be integrated with microelectronics. Standard lithography and reactive ion etching are normally carried
Conclusions
In conclusion we demonstrated the combination of proton beam writing and electrochemical etching for fabricating smooth optical devices in silicon without the need for a mask. Optical isolation is created by undercutting the irradiated structure, to provide a porous silicon cladding. This process eliminates the use of expensive SOI substrates as the fabrication can be carried out directly in silicon. A low loss silicon-on-oxidized porous silicon strip waveguide of 1 dB/cm has been obtained using
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