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Microelectronics Journal
Volume 37, Issue 2, February 2006, Pages 114-120
 
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doi:10.1016/j.mejo.2005.04.048    How to Cite or Link Using DOI (Opens New Window)
Copyright © 2005 Elsevier Ltd All rights reserved.

Tunnel charge transport within silicon in reversely-biased MOS tunnel structures

M.I. Vexlera, Corresponding Author Contact Information, E-mail The Corresponding Author, A. El Hdiyb, D. Grgecc, S.E. Tyaginova, R. Khlilb, B. Meinerzhagenc, A.F. Shulekina and I.V. Grekhova

aA.F. Ioffe Institute, 26 Polytechnicheskaya, 194021 St Petersburg, Russia bLMEN(EA), UFR Sciences, BP 1039, 51687 Reims cedex 2, France cInstitut für Netzwerktheorie und Schaltungstechnik, TU-Braunschweig, Pf. 3329, 38023 Braunschweig, Germany

Received 25 November 2004; 
revised 5 April 2005; 
accepted 12 April 2005. 
Available online 13 June 2005.

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Abstract

The features of the electrical behaviour of a MOS tunnel structure, which arise from the tunnel carrier transport in semiconductor, are considered. For the explicitely given band diagram, the total current increases due to the contribution of electrons in energy range where the only-oxide tunneling is impossible. The resonance transport via the discrete levels in the quantum well may introduce steps in the reverse current–voltage characteristic. The band-to-band tunneling, which is to be treated as semiconductor tunneling, perturbates the balance of minority carriers in the inversion layer, modifying the charge state of a MOS structure. The stationary non-equilibrium support of a large surface carrier concentration becomes therefore possible, and the voltage partitioning in the MOS structure is distorted.

Article Outline

1. Problem formulation
2. Semiconductor transmission probability
3. Band-to-band tunneling in silicon (BBT)
4. Quantization effects in conduction band
5. Oxide transmission probability
6. Valence band - metal tunneling (VMT)
7. Resonant tunneling (RT)
8. Band diagram–total current–capacitance
9. Note on the effective masses
10. Simulated IV and CV characteristics
11. Experimental support
12. Observation of the resonant features
13. Conclusions
Acknowledgements
References










Microelectronics Journal
Volume 37, Issue 2, February 2006, Pages 114-120
 
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