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Computer-Aided Design
Volume 39, Issue 3, March 2007, Pages 190-201
Micro-/Nano-Technology Applications of CAD/CAM/CAE
 
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doi:10.1016/j.cad.2006.08.006    How to Cite or Link Using DOI (Opens New Window)
Copyright © 2006 Elsevier Ltd All rights reserved.

Solid-based CAPP for surface micromachined MEMS devices

Jianhua Lia, b, E-mail The Corresponding Author, Shuming Gaoa, E-mail The Corresponding Author and Yusheng Liua, Corresponding Author Contact Information, E-mail The Corresponding Author

aState Key Lab of CAD&CG, Zhejiang University, Hangzhou 310027, China bDepartment of Computer Science and Engineering, East China University of Science and Technology, Shanghai 200237, China

Received 15 January 2006; 
accepted 31 August 2006. 
Available online 2 November 2006.

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Abstract

Process planning for a MEMS device is almost always conducted manually by the designer to date. As the structures of MEMS devices become more and more complicated, in order to release the designers from the hard and tedious work and speed up the development of MEMS products, such a situation should be changed. In this study, a solid based CAPP method for surface micromachined MEMS device is presented. With this method, a MEMS device is designed with a traditional CAD system, and its process planning is conducted automatically based on the solid model created. The process features with engineering semantics are extracted first. Then, the process layer model is constructed with each process layer of the model being coincident with the fabrication layer of surface micromachining. Finally, the masks are synthesized and the fabrication process is generated. Furthermore, to guarantee the manufacturability of the designed MEMS device, a systematic evaluation method is proposed. The proposed design and CAPP methods enable designers to concentrate on functional and shape design of MEMS devices.

Keywords: CAPP; Solid model; MEMS; CAD

Abbreviations: MEMS: Micro Electromechanical Systems; VLSI: Very Large Scale Integration; CAPP: Computer Aided Process Planning; MBF: Manufacturing Base Face; PF: Process Feature; MUMPs: Multi-User MEMS Processes; MD: Manufacturing Direction; SLEME: Single-Layer Etching Manufacturability Evaluation; MLEME: Multi-Layer etching Manufacturability Evaluation.

Article Outline

1. Introduction
2. Related work
3. Method overview
4. Process layer modeling
4.1. Initial manufacturability evaluation on the input solid model
4.2. Process feature recognition
4.3. Feature based process layer modeling
4.4. Process layer model adaptation for multi-layer etch
5. Manufacturability evaluation of process layer model
5.1. Contact evaluation of all process layers
5.2. Manufacturability evaluation of etching
5.2.1. SLEME
5.2.2. MLEME
6. Mask synthesis based on process layer model
6.1. Generation of the initial masks and process sequence
6.2. Generation of the final masks
7. Verification of the synthesized masks
8. Implementation
9. Conclusion
Acknowledgements
References





















Computer-Aided Design
Volume 39, Issue 3, March 2007, Pages 190-201
Micro-/Nano-Technology Applications of CAD/CAM/CAE
 
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