ScienceDirect® Home Skip Main Navigation Links
You have guest access to ScienceDirect. Find out more.
 
Home
Browse
My Settings
Alerts
Help
 Quick Search
 Search tips (Opens new window)
    Clear all fields    
advertisementadvertisement
Microelectronics and Reliability
Volume 38, Issue 12, December 1998, Pages 1949-1954
 
Font Size: Decrease Font Size  Increase Font Size
 Abstract - selected
Article
Purchase PDF (261 K)

 
 
 
Related Articles in ScienceDirect
View More Related Articles
 
View Record in Scopus
 
doi:10.1016/S0026-2714(98)00155-3    How to Cite or Link Using DOI (Opens New Window)
Copyright © 1998 Published by Elsevier Science Ltd. All rights reserved

Research Note

Application of a ‘surrogate’ layer for lower bending stress in a vulnerable material of a tri-material body

E. Suhira, * and J. D. Welda

a Bell Laboratories, Lucent Technologies Inc., 600 Mountain Ave, Murray Hill, NJ 07974, USA

Received 22 December 1997;
revised 4 July 1998.
Available online 30 December 1998.

Purchase the full-text article



References and further reading may be available for this article. To view references and further reading you must purchase this article.

Abstract

Low strength materials in multi-layer (multi-body) structures subjected to temperature change often fail because of the high curvatures and bending stresses caused by the elevated thermal expansion (contraction) mismatch of the constituent materials. In some cases, an introduction of an additional, ‘surrogate’, layer (not needed from the standpoint of the normal operation of the system) of a high expansion (contraction) and/or high modulus material can be an effective means to flatten the composite structure, thereby reducing the bending stress in the vulnerable material. We consider an epoxy molding compound on a thin ceramic substrate, and suggest that a ‘surrogate’ layer of a high coefficient of thermal expansion (CTE) and high modulus polymeric material be applied onto the outer side of the substrate to flatten the structure. Clearly, the ‘surrogate’ material should be able to withstand high tensile stresses. We suggest also that this material be processed concurrently with the basic molding operation. A simple formula is obtained for choosing the appropriate thickness of the ‘surrogate’ layer for the given material(s) in the package, including the ‘surrogate’ material itself.

Article Outline

1. Introduction
2. Basic equations
3. Flexural rigidity
4. Stresses
5. Numerical examples
6. Conclusion
References




 
Home
Browse
My Settings
Alerts
Help
Elsevier.com (Opens new window)
About ScienceDirect  |  Contact Us  |  Information for Advertisers  |  Terms & Conditions  |  Privacy Policy
Copyright © 2008 Elsevier B.V. All rights reserved. ScienceDirect® is a registered trademark of Elsevier B.V.