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Journal of the Mechanics and Physics of Solids
Volume 48, Issue 5, 1 May 2000, Pages 867-897
 
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doi:10.1016/S0022-5096(99)00064-2    How to Cite or Link Using DOI (Opens New Window)
Copyright © 2000 Elsevier Science Ltd. All rights reserved.

Crack channelling and spalling in a plate due to thermal shock loading

L. G. Zhao, T. J. LuCorresponding Author Contact Information, E-mail The Corresponding Author and N. A. Fleck

Department of Engineering, University of Cambridge, Cambridge CB2 1PZ, UK

Received 12 May 1999;
revised 24 August 1999.
Available online 8 March 2000.

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Abstract

The propagation of a pre-existing edge crack across a finite plate subjected to cold shock has been studied. The plate, initially at uniform temperature, is exposed to a cold shock on one surface whilst three different types of heat transfer boundary condition are separately considered for the opposing face: cold shock, thermal insulation and fixed temperature. For all three boundary conditions, the plate experiences tensile stress near the cold-shocked surface and compressive stressing near the mid-plane. Consequently, a Mode I edge crack extending into the compressive region may grow in one of three different modes: continued extension in plane strain, channelling and spalling. The thermal shock conditions governing each failure mode are quantified, with a focus on crack channelling and spalling. The dislocation method is employed to calculate the energy release rates for plane strain cracking and steady-state channelling. For steady-state spalling, the energy release rate is obtained by an energy analysis of elastic beams far ahead and far behind the crack tip. Analytical solutions are also obtained in the short crack limit in which the problem is reduced to an edge crack extending in a half space; and the parameter range over which the short crack solution is valid for a finite plate is determined. Failure maps for the various cracking patterns are constructed in terms of the critical temperature jump and Biot number, and merit indices are identified for materials selection against failure by thermal shock.

Author Keywords: A. Crack branching; A. Fracture; B. Thermal stress; B. Crack mechanics

Article Outline

1. Introduction
1.1. Scope of the present study
2. Temperature and stress fields
2.1. The thermal model
2.2. Evolution of temperature and stress
3. Plane strain cracking under thermal shock
4. Channelling under thermal shock
5. Spalling under thermal shock
5.1. Effect of T-stress on directional stability of crack extension
5.2. Initiation and steady-state growth of spalling cracks
5.2.1. Initiation of kinking (cmuch less-thana)
5.2.2. Steady-state spalling (cmuch greater-thana)
6. Solutions in the short crack limit
6.1. Plane strain cracking
6.2. Steady-state channelling
6.3. Steady-state spalling
7. Merit indices for thermal shock
Acknowledgements
Appendix A. Temperature and stress fields (Cases II and III)
Appendix. Calculation of T-stress
References















 
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