The Effect of Pad Wear on the Chemical Mechanical Polishing of Silicon Wafers
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2020, Precision EngineeringCitation Excerpt :Because the thickness uniformity of a wafer, especially, is critical to achieving high yield in semiconductor manufacturing [3,4], there is a continuing demand for further improvement in the surface flatness of a wafer. However, the surface flatness significantly deteriorates near the wafer edge because edge roll-off (ERO) occurs in the polishing process as the final stage of wafer manufacturing [5]. Reduction in the amount of ERO in the polishing process, therefore, is one of the most crucial technical challenges for every wafer manufacturer.
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