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Electrochemical Study of Spark Plasma-Sintered Copper Reinforced with Ni/SiC Micron-Sized Particles for Electrical Applications

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Abstract

In the research study, incorporation of Cu with hard SiC and Ni micron-sized particles was applied in the fabrication of a multifunctional copper-based metal matrix composite using spark plasma sintering. The developed spark plasma-sintered Cu–xNi and Cu–xNi–xSiC composite charateristics were studied by conducting morphological analysis, electrochemical, microhardness, and densification tests. Analytical equipments used include scanning electron microscopy, equipped elemental dispersive spectroscopy, X-ray diffractometry, and Vickers hardness tester. Electrochemical characterizations using potentiodynamic polarization for the electrochemical stability of the sintered composite in 0.5 M H2SO4 was also carried out. 96% densification and 90.20% corrosion resistance were obtained. The Cu–Ni composite showed an increase in corrosion resistance as a result of Ni addition in H2SO4 environment, while Cu–xNi–xSiC composite showed a slight decrease in corrosion resistance with excess SiC. It can be inferred that Cu–xNi and Cu–NixSiC composites improves the hardness values and corrosion resistance for electrical application when applied.

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Authors and Affiliations

  1. Department of Chemical Metallurgical & Materials Engineering, Tshwane University of Technology, P.M.B X680, Pretoria, South Africa

    K. Machethe, A. P. I. Popoola & V. S. Aigbodion

  2. Department of Electrical Engineering, Tshwane University of Technology, P.M.B X680, Pretoria, South Africa

    O. M. Popoola

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  1. K. Machethe
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  2. A. P. I. Popoola
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  3. V. S. Aigbodion
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  4. O. M. Popoola
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Correspondence to V. S. Aigbodion.

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Machethe, K., Popoola, A.P.I., Aigbodion, V.S. et al. Electrochemical Study of Spark Plasma-Sintered Copper Reinforced with Ni/SiC Micron-Sized Particles for Electrical Applications. Iran J Sci Technol Trans Sci 43, 457–464 (2019). https://doi.org/10.1007/s40995-017-0429-0

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  • DOI: https://doi.org/10.1007/s40995-017-0429-0

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