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In situ X-ray observation and simulation of ratcheting-fatigue interactions in solder joints

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Abstract

Reflow voids created by solder oxidation reduce the reliability of lap joints. In situ visualization of reflow voids in Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints under cyclic stressing was realized by X-ray computed tomography (CT), while the ratcheting deformation of the solder joints was monitored by a non-contact displacement detecting system (NDDS). The results revealed that the shape evolution of reflow voids in solder joints, as characterized by the sphericity of the voids, can be divided into three stages: i.e., the initial stage with a sharp drop, a stable stage, and a rapidly declining stage. A new evolution law for describing the progress of sphericity was proposed, and was further introduced into a viscoplastic constitutive model based on the OW-AF nonlinear kinematic hardening rule. The damage-coupled OW-AF model yielded an accurate estimation of the whole-life ratcheting behavior of Sn-3Ag-0.5Cu (SAC305) lap-shear solder joints.

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Authors and Affiliations

  1. School of Chemical Engineering and Technology, Tianjin University, Tianjin, 300072, China

    Liting Shi, Gang Chen & Xu Chen

  2. Tianjin Key Laboratory of Advanced Joining Technology, and School of Material Science and Engineering, Tianjin University, Tianjin, 300072, China

    Yunhui Mei

Authors
  1. Liting Shi
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  2. Yunhui Mei
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  3. Gang Chen
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  4. Xu Chen
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Correspondence to Gang Chen.

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Shi, L., Mei, Y., Chen, G. et al. In situ X-ray observation and simulation of ratcheting-fatigue interactions in solder joints. Electron. Mater. Lett. 13, 97–106 (2017). https://doi.org/10.1007/s13391-017-6018-8

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  • DOI: https://doi.org/10.1007/s13391-017-6018-8

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