Abstract
Light emitting diodes (LEDs) as the emerging green light sources are of great significance to achieve the energy saving and emission reduction. The encapsulation materials as the key supporting and protection materials can directly influence the reliability, performance, and service life of LEDs. Thus, the encapsulation materials with ideal properties including high transmittance, high refractive index (RI), excellent mechanical property, high thermal conductivity, and high aging resistance are urgently needed in the LEDs-based semiconductor lighting field. Epoxy resins and organic silicone resins as the main two traditional encapsulation materials still have some problems, such as low RI, poor mechanical property, prone to yellowing, easy to aging, and so on. To overcome these problems, numerous researches were conducted to improve the overall performances of epoxy resins and organic silicone resins for LED encapsulation. Especially, the organic-inorganic nanocomposite materials can combine the advantages of inorganic nanoparticles and organic resins and show excellent performance for LED encapsulation, hence drawing more and more attention. This review will summarize the recent development of epoxy resin materials, organic silicone materials, and organic-inorganic nanocomposite materials for LED encapsulation, and outlook the key problems and future development direction of the LED encapsulation industry.
Similar content being viewed by others
Data Availability
My manuscript has no associated data and materials.
References
Hamidnia M, Luo Y, Wang XD (2018) Application of micro/nano technology for thermal management of high power LED packaging-a review. Appl Therm Eng 145:637–651
Kalyani NT, Dhoble SJ (2012) Organic light emitting diodes: energy saving lighting technology-a review. Renew Sust Energy Rev 16:2696–2723
Wu BS, Hitti Y, MacPherson S, Orsat V, Lefsrud MG (2020) Comparison and perspective of conventional and LED lighting for photobiology and industry applications. Environ Exp Bot 171:103953
Alim MA, Abdullah MZ, Aziz MSA, Kamarudin R (2021) Die attachment, wire bonding, and encapsulation process in LED packaging: a review. Sens Actuators A 329:112817
Deng Z, Wang M, Zhu C, Li C, Liu J, Tu M, Xie L, Gui D (2019) Study on light aging of anhydride-cured epoxy resin used for RGB LED packaging material. Polym Test 80:106131
Zhan X, Zhang J, Wang X, Cheng J (2012) Progress on silicone packaging materials for power LED. Procedia Eng 27:687–692
Chen Z, Liu Z, Shen G, Wen R, Lv J, Huo J, Yu Y (2016) Effect of chain flexibility of epoxy encapsulants on the performance and reliability of light-emitting diodes. Ind Eng Chem Res 55:7635–7645
Tang B, Liu X, Zhao X, Zhang J (2014) Highly efficient in situ toughening of epoxy thermosets with reactive hyperbranched polyurethane. J Appl Polym Sci 131:40614
Ma S, Liu W, Gao N, Yan Z, Zhao Y (2011) Synthesis and properties of LED-packaging epoxy resin toughened by a novel polysiloxane from hydrolysis and condensation. Macromol Res 19:972–979
Liu Y, Luan X, Feng Y, Tan X, Han Y, Sun X (2018) Self-adhesive epoxy modified silicone materials for light emitting diode encapsulation. Polym Adv Technol 28:1473–1479
Tong L, Feng Y, Sun X, Han Y, Jiao D, Tan X (2018) High refractive index adamantane-based silicone resins for the encapsulation of light-emitting diodes. Polym Adv Technol 29:2245–2252
Kim Y, Kim S, Iqbal F, Yie H, Kim H (2015) Effect of transmittance on luminescence properties of phosphor-in-glass for LED packaging. Opt Express 23:A43–A50
Ru Y, Zhang X, Wang L, Dai L, Yang W, Qiao J (2015) Polymer composites with high haze and high transmittance. Polym Chem 6:6632–6636
Arik M, Becker CA, Weaver SE, Petroski J (2004) Thermal management of LEDs: package to system. Proc SPIE 5187:64–75
Yung KC, Liem H, Choy HS (2013) Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler. Appl Opt 52:8484–8493
Park BG, Myung WR, Lee CJ, Jung SB (2020) Mechanical, electrical, and thermal reliability of Sn-58wt.% bi solder joints with ag-decorated MWCNT for LED package component during aging treatment. Composites Part B 182:107617
Zhao X, Hou Z, Wang B, Shen Q, Jia H, Zhang A, Liu X, Xu B (2017) Synthesis, luminance and ultraviolet resistance of a copolymer phosphor of Eu-complex and siloxane in near UV-based LED. Res Chem Intermed 43:4129–4143
Wen R, Huo J, Lv J, Liu Z, Yu Y (2017) Effect of silicone resin modification on the performance of epoxy materials for LED encapsulation. J Mater Sci Mater Electron 28:14522–14535
Chung PT, Yang CT, Wang SH, Chen CW, Chiang AST, Liu CY (2012) ZrO2/epoxy nanocomposite for LED encapsulation. Mater Chem Phys 136:868–876
Gao N, Liu WQ, Ma SQ, Tang C, Yan Z (2012) Cycloaliphatic epoxy resin modified by two kinds of oligo-fluorosiloxanes for potential application in light-emitting diode (LED) encapsulation. J Polym Res 19:1–10
Hsieh TH, Kinloch AJ, Taylor AC, Sprenger S (2011) The effect of silica nanoparticles and carbon nanotubes on the toughness of a thermosetting epoxy polymer. J Appl Polym Sci 119:2135–2142
Ladani RB, Wu S, Kinloch AJ, Ghorbani K, Zhang J, Mouritz AP, Wang CH (2015) Improving the toughness and electrical conductivity of epoxy nanocomposites by using aligned carbon nanofibres. Compos Sci Technol 117:146–158
Salom C, Prolongo MG, Toribio A, Martínez-Martínez AJ, de Cárcer IA, Prolongo SG (2018) Mechanical properties and adhesive behavior of epoxy-graphene nanocomposites. Int J Adhes Adhes 84:119–125
Wu Z, Wang M, Wang Z (2015) The gas phase SiO2/epoxy nanocomposites with enhanced mechanical and thermal properties. High Perform Polym 27:469–475
Sun Y, Liu W, Tan J, Wang H (2016) Nano-and micro-structured random copolymer modified cycloaliphatic epoxy resins for use as light-emitting diode encapsulation. J Macromol Sci Part A 53:201–209
Gao N, Liu WQ, Ma SQ, Yan ZL, Zhao Y (2012) Modification of epoxy resin with cycloaliphatic-epoxy oligosiloxane for light-emitting diode (LED) encapsulation application. J Macromol Sci Part B 51:1509–1524
Liu J, Ueda M (2009) High refractive index polymers: fundamental research and practical applications. J Mater Chem 19:8907–8919
Higashihara T, Ueda M (2015) Recent progress in high refractive index polymers. Macromolecules 48:1915–1929
Luo C, Zuo J, Zhao J (2013) Synthesis and property of epoxy prepolymer and curing agent with high refractive index. High Perform Polym 25:986–991
Luo C, Zuo J, Wang F, Yuan Y, Lin F, Huang H, Zhao J (2016) High refractive index and flame retardancy of epoxy thermoset cured by tris (2-mercaptoethyl) phosphate. Polym Degrad Stab 129:7–11
Chen G, Zhang Q, Hu Z, Wang S, Wu K, Shi J, Liang L, Lu M (2019) Liquid crystalline epoxies bearing biphenyl ether and aromatic ester mesogenic units: synthesis and thermal properties. J Macromol Sci Part A 56:484–495
Zhang Q, Chen G, Wu K, Shi J, Liang L, Lu M (2020) Biphenyl liquid crystal epoxy containing flexible chain: synthesis and thermal properties. J Appl Polym Sci 137:e49143
Yang X, Zhu J, Yang D, Zhang L, Guo Y, Zhong X, Kong J, Gu J (2020) High-efficiency improvement of thermal conductivities for epoxy composites from synthesized liquid crystal epoxy followed by doping BN fillers. Composites Part B 185:107784
Islam AM, Lim H, You NH, Ahn S, Goh M, Hahn JR, Yeo H, Jang SG (2018) Enhanced thermal conductivity of liquid crystalline epoxy resin using controlled linear polymerization. ACS Macro Lett 7:1180–1185
Anithambigai P, Chakravarthii MKD, Mutharasu D, Huong LH, Zahner T, Lacey D, Kamarulazizi I (2017) Potential thermally conductive alumina filled epoxy composite for thermal management of high power LEDs. J Mater Sci Mater Electron 28:856–867
Chen Y, Hou X, Liao M, Dai W, Wang Z, Yan C, Li H, Lin C, Jiang N, Yu J (2020) Constructing a “pea-pod-like” alumina-graphene binary architecture for enhancing thermal conductivity of epoxy composite. Chem Eng J 381:122690
Chen X, Lim JSK, Yan W, Guo F, Liang YN, Chen H, Lambourne A, Hu X (2020) Salt template assisted BN scaffold fabrication toward highly thermally conductive epoxy composites. ACS Appl Mater Interfaces 12:16987–16996
Lin CH, Whang WT, Chen CH et al (2020) Novel siloxane-modified epoxy resins as promising encapsulant for LEDs. Polymers 12:21
Yurrita N, Aizpurua J, Cambarau W, Huang S, Chen K (2021) Photovoltaic modules encapsulated in composite material modified with ultraviolet additives. Sol Energy Mater Sol Cells 230:111250
Gan Y, Jiang X, Yin J (2014) Thiol-ene photo-curable hybrid silicone resin for LED encapsulation: enhancement of light extraction efficiency by facile self-keeping hemisphere coating. J Mater Chem C 2:5533–5539
Kim JS, Yang SC, Kwak SY, Choi YW, Paik KW, Bae BS (2012) High performance encapsulant for light-emitting diodes (LEDs) by a sol-gel derived hydrogen siloxane hybrid. J Mater Chem 22:7954–7960
He Q, Li A, Zhang Y, Liu S, Guo Y, Kong L (2018) A study on mechanical and tribological properties of silicone rubber reinforced with white carbon black. Tribol-Mater Surf Interfaces 12:9–16
Li Y, Chen Z, Li X, Zeng H (2011) A new surface modification method to improve the dispersity of nano-silica in organic solvents. J Sol-Gel Sci Technol 58:290–295
Di M, He S, Li R, Yang D (2006) Radiation effect of 150 keV protons on methyl silicone rubber reinforced with MQ silicone resin. Nucl Instr Meth Phys Res B 248:31–36
Pradhan B, Srivastava SK (2014) Layered double hydroxide/multiwalled carbon nanotube hybrids as reinforcing filler in silicone rubber. Composites Part A 56:290–299
Ma W, Li J, Deng B, Lin X, Zhao X (2013) Properties of functionalized graphene/room temperature vulcanized silicone rubber composites prepared by an in-situ reduction method. J Wuhan Univ Technol Mater Sci Ed 28:127–131
Hu H, Ma J, Li X, Yin Q, Fan L, Wei X, Peng Q, Yang J (2019) Benzocyclobutene-functional double-decker silsesquioxane: self-assembled hybrid resin for high-performance dielectrics and LED encapsulants. Polym Chem 10:4551–4560
Lee S, Hong JY, Jang J (2013) Multifunctional graphene sheets embedded in silicone encapsulant for superior performance of light-emitting diodes. ACS Nano 7:5784–5790
Zhang H, Lin Y, Zhang D, Wang W, Xing Y, Lin J, Hong H, Li C (2016) Graphene nanosheet/silicone composite with enhanced thermal conductivity and its application in heat dissipation of high-power light-emitting diodes. Curr Appl Phys 16:1695–1702
Gao J, Bao F, Wu Q, Ma R, Han X, Jin D, Chen K, He J, Guo Z, Yan C (2016) Multifunctional graphene filled silicone encapsulant for high-performance light-emitting diodes. Mater Today Commun 7:149–154
Gui D, Yu S, Xiong W, Cai X, Liu C, Liu J (2016) Liquid crystal functionalization of graphene nanoplatelets for improved thermal and mechanical properties of silicone resin composites. RSC Adv 6:35210–35215
Zhao X, Zang C, Ma Q, Wen Y, Jiao Q (2016) Thermal and electrical properties of composites based on (3-mercaptopropyl) trimethoxysilane-and cu-coated carbon fiber and silicone rubber. J Mater Sci 51:4088–4095
Yang D, Huang S, Ruan M, Li S, Yang J, Wu Y, Guo W, Zhang L (2018) Mussel inspired modification for aluminum oxide/silicone elastomer composites with largely improved thermal conductivity and low dielectric constant. Ind Eng Chem Res 57:3255–3262
Xu S, Gao Q, Zhou C, Li J, Shen L, Lin H (2021) Improved thermal stability and heat-aging resistance of silicone rubber via incorporation of UiO-66-NH2. Mater Chem Phys 274:125182
Wu S, Xiong Q, Li X, Chen D, Liu B (2021) Properties of thermally conductive silicone rubbers filled with admicellar polymerized polypyrrole-coated Al2O3 particles. J Appl Polym Sci 138:50205
Pan Z, Zhu S, Huang B, Kang Y, Zhu L (2019) Synthesis of high-refractive-index epoxy-modified vinyl methyl phenyl silicone resins for encapsulation of LEDs. J Electron Mater 48:2865–2875
Pan Z, Chen M, Zeng K, Kang Y (2022) Synthesis of epoxy-modified methyl phenyl silicone resins for LED encapsulation. Silicon 14:1159–1167
Novak BM (1993) Hybrid nanocomposite materials-between inorganic glasses and organic polymers. Adv Mater 5:422–433
Tao P, Li Y, Siegel RW, Schadler LS (2013) Transparent dispensible high-refractive index ZrO2/epoxy nanocomposites for LED encapsulation. J Appl Polym Sci 130:3785–3793
Mont FW, Kim JK, Schubert MF, Schubert EF, Siegel RW (2008) High-refractive-index TiO2-nanoparticle-loaded encapsulants for light-emitting diodes. J Appl Phys 103:083120
Ding KH, Wang GL, Zhang M (2012) Preparation and optical properties of transparent epoxy composites containing ZnO nanoparticles. J Appl Polym Sci 126:734–739
Im H, Kim J (2012) Thermal conductivity of a graphene oxide-carbon nanotube hybrid/epoxy composite. Carbon 50:5429–5440
Agrawal A, Satapathy A (2015) Epoxy composites filled with micro-sized AlN particles for microelectronic applications. Part Sci Technol 33:2–7
Constantinescu DM, Apostol DA, Picu CR, Krawczyk K, Sieberer M (2017) Mechanical properties of epoxy nanocomposites reinforced with functionalized silica nanoparticles. Procedia Struct Integr 5:647–652
Lai Y, Jin L, Hang J, Sun X, Shi L (2015) Highly transparent thermal stable silicone/titania hybrids with high refractive index for LED encapsulation. J Coat Technol Res 12:1185–1192
Zhan X, Xing Q, Liu H, Zhang J, Cheng J, Lin X (2014) A facile method for fabrication of titanium-doped hybrid materials with high refractive index. RSC Adv 4:13909–13918
Huang Y, Feng Y, Sun X, Han Y, Liu D, Tan X (2019) Preparation of ZrO2/silicone hybrid materials for LED encapsulation via in situ sol-gel reaction. Polym Adv Technol 30:1818–1824
Kim YH, Bae JY, Jin J, Bae BS (2014) Sol-gel derived transparent zirconium-phenyl siloxane hybrid for robust high refractive index LED encapsulant. ACS Appl Mater Interfaces 6:3115–3121
Yang Y, Li YQ, Shi HQ, Li WN, Xiao HM, Zhu LP, Luo YS, Fu SY, Liu TX (2011) Fabrication and characterization of transparent ZnO-SiO2/silicone nanocomposites with tunable emission colors. Composites Part B 42:2105–2110
Trung NN, Luu QP, Son BT, Sinh LH, Bae JY (2012) Preparation and characterization of silicone resin nanocomposite containing CdSe/ZnS quantum dots. Polym Compos 33:1785–1791
Cheng Y, Lu C, Yang B (2011) A review on high refractive index nanocomposites for optical applications. Recent Pat Mater Sci 4:15–27
James J, Unni AB, Taleb K, Chapel JP, Kalarikkal N, Varghese S, Vignaud G, Grohens Y (2019) Surface engineering of polystyrene-cerium oxide nanocomposite thin films for refractive index enhancement. Nano-Struct Nano-Objects 17:34–42
Author information
Authors and Affiliations
Contributions
JS: writing and original draft preparation and review and editing of the manuscript, YF: reviewing of the manuscript and supervision.
Corresponding author
Ethics declarations
Competing Interests
The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
Ethics Approval
NA.
Consent to Participate
NA.
Consent for Publication
The consent has been taken from all authors/co-authors for the publication.
Research Involving Human Participants and/or Animals
NA.
Informed Consent
NA.
Competing Interests
The authors have no relevant financial or non-financial interests to disclose.
Additional information
Publisher’s Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Shen, J., Feng, Y. Recent Advances in Encapsulation Materials for Light Emitting Diodes: a Review. Silicon 15, 2163–2172 (2023). https://doi.org/10.1007/s12633-022-02171-y
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12633-022-02171-y