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Formation of microstructure by copper-cuprous co-electrodeposition using stirring and boric acid addition

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Abstract

This paper reports the effects of the stirring rate of the solution, boric acid concentration, and applied current density on the formation of the copper-cuprous co-electrodeposited structure. For copper-cuprous co-electrodeposition, 0.5 M CuSO4·5H2O solution was used. When electrodeposition was performed via stirring and the addition of boric acid, pillar-type electrodeposited structures were formed. On the other hand, when electrodeposition was carried out without stirring or the addition of boric acid, hill-type electrodeposited structures were formed. Development of the pillar structure was promoted by increasing the boric acid concentration and the stirring rate. The electrodeposited structure was applied to surface modification in order to verify its industrial effectiveness. When the concentration of the added boric acid was higher than 0.5 M and the stirring rate of the solution was 200 rpm, the fabricated specimens showed superhydrophobic properties after hydrophobic layer coating.

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Authors and Affiliations

  1. Graduate School of Mechanical Engineering, Pusan National University, Busandaehak-ro 63beon-gil, Geumjeong-gu, Busan, 48075, South Korea

    Jae Min Lee

  2. Research & Development Team 1, Hanwha Corporation, 264-36, Sanho-daero, Gumi-si, Gyeongsangbuk-do, 39370, South Korea

    Jae Min Lee & Jong Soo Ko

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  1. Jae Min Lee
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  2. Jong Soo Ko
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Correspondence to Jong Soo Ko.

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Lee, J.M., Ko, J.S. Formation of microstructure by copper-cuprous co-electrodeposition using stirring and boric acid addition. Int. J. Precis. Eng. Manuf. 18, 871–877 (2017). https://doi.org/10.1007/s12541-017-0103-7

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  • DOI: https://doi.org/10.1007/s12541-017-0103-7

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