References
K. Suganuma, Curr. Opin. Solid State Mater. Sci., 5(1) (2001), pp. 55–64.
K.N. Tu, A.M. Gusak, and M. Li, J. Appl. Phys., 93 (2003), pp. 1335–1352.
J.H. Kim, S.W. Jeong, and H.M. Lee, Mater. Trans., 43 (2002), pp. 1873–1878.
S.F. Corbin, J. Electron. Mater., 34 (2005), pp. 1016–1025.
M. Rettenmayr, P. Lambracht, and B. Kempf, Adv. Engineer. Mater., 7 (2005), pp. 965–969.
E. Gervais, R.J. Barnhurst, and C.A. Loong, J. Metals, 37(11) (1985), pp. 43–47.
F. Cay and C. Kurnaz, Mater. Design, 26 (2005), pp. 479–485.
M. Rettenmayr et al., J. Electron. Mater., 31 (2002), pp. 278–285.
N. Kang et al., J. Alloys Comp., (2008), doi:10.1016/j.jallcom.2007.12.048.
T. Shimuzu et al., J. Electron. Mater., 28 (1999), pp. 1172–1175.
S.J. Kim et al., Mater. Trans., 49 (2008), pp. 1531–1536.
K. Suganuma, J.-E. Lee, and K.-S. Kim, “Zn-Sn and Zn-In High Temperature Lead-Free Solders” (Presentation at the 2007 MRS Spring Meeting Symposium E: Pb-Free and RoHS-Compliant Materials and Processes for Microelectronics, San Francisco, April 11–12, 2007).
J.E. Lee et al., Mater. Trans., 46 (2005), pp. 2413–2418.
J.E. Lee et al., Mater. Trans., 48 (2007), pp. 584–593.
S.J. Kim et al., J. Electron. Mater. (2008), doi: 10.1007/s11664-008-0550-0.
S. Motojima and H. Mizutani, J. Mater. Sci., 23 (1988), pp. 3435–3439.
S.-J. Kim et al., “Interfacial Reactions of Die Attached AlN-DBC Module Using Zn-Sn High Temperature Solders” (Presentation at the TMS 2008 Annual Meeting & Exhibition, New Orleans, March 10–14, 2008).
K. Suganuma et al., J. Mater. Res., 13 (1998), pp. 2859–2865.
M. Ueshima, private communication (March 24, 2008).
J.M. Song, H.Y. Chuang, and Z.M. Wu, J. Electron. Mater., 35 (2006), pp. 1041–1048.
K. Suganuma, Polymer and Adhesives in Microelectronics and Photonics (Piscataway, NJ: IEEE, 2007), pp. 30–35.
J.N. Lalena, N.F. Dean, and M.W. Weiser, J. Electron. Mater., 31 (2002), pp. 1244–1249.
Yi Li and C.P. Wong, Mater. Sci. Engineer. R., 51(1–3) (2006), pp. 1–35.
T. Tashiro, private communication (March 24, 2008).
M. Vuorela et al, Proc. 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 2000 (Piscataway, NJ: IEEE, 2000), pp. 147–152.
H.G. Song, J.W. Morris, and M.T. McCormack, J. Electron. Mater., 29 (2000), pp. 1038–1046.
J.Y. Tsai et al., J. Electron. Mater., 35(1) (2006), pp. 65–71.
J.W. Yoon et al., J. Mater. Res., 22(10) (2007), pp. 2817–2824.
J.W. Yoon, H.S. Chun, and S.B. Jung, J. Mater. Res., 22(5) (2007), pp. 1219–1229.
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Suganuma, K., Kim, SJ. & Kim, KS. High-temperature lead-free solders: Properties and possibilities. JOM 61, 64–71 (2009). https://doi.org/10.1007/s11837-009-0013-y
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DOI: https://doi.org/10.1007/s11837-009-0013-y