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Key-insulated aggregate signature

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Abstract

In order to minimize the damage caused by key exposure in aggregate signatures, a key-insulated aggregate signature scheme is proposed in this paper. We give the definition and the security model of the key-insulated aggregate signature. We also construct a concrete key-insulated aggregate signature scheme that meets our definition. Our scheme has the properties of efficient verification and short signature length. We prove the security of our scheme in the random oracle model under the computation Diffie-Hellman assumption.

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Authors and Affiliations

  1. College of Information Engineering, Qingdao University, Qingdao, 266071, China

    Huiyan Zhao, Jia Yu, Shaoxia Duan, Xiangguo Cheng & Rong Hao

  2. Shandong Provincial Key Laboratory of Computer Network, Jinan, 250014, China

    Jia Yu

  3. State Key Laboratory of Information Security, Institute of Information Engineering, Chinese Academy of Sciences, Beijing, 100093, China

    Jia Yu

Authors
  1. Huiyan Zhao
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  2. Jia Yu
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  3. Shaoxia Duan
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  4. Xiangguo Cheng
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  5. Rong Hao
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Corresponding author

Correspondence to Jia Yu.

Additional information

Huiyan Zhao, born in 1986. Master candidate in Qingdao University. Her research interests include cryptography and information security.

Jia Yu, born in 1976. PhD and professor in Qingdao University. Senior member of China Computer Federation. His main research interests are cryptography and network security.

Shaoxia Duan, born in 1989. Master candidate in Qingdao University. Her research interests include cryptography and information security.

Xiangguo Cheng, born in 1969. PhD and associate professor in Qingdao University, His main research interests are cryptography and network security.

Rong Hao, born in 1976. Master and lecturer in Qingdao University, Her main research interests are cryptography and network security.

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Zhao, H., Yu, J., Duan, S. et al. Key-insulated aggregate signature. Front. Comput. Sci. 8, 837–846 (2014). https://doi.org/10.1007/s11704-014-3244-1

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  • DOI: https://doi.org/10.1007/s11704-014-3244-1

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