Abstract
The stability of a 2 butyl, 5 chloro, benzimidazole film (BCB) before and after a thermal treatment, which simulated the annealing of a typical soldering process, was the main motivation of the present work. The chemical bonds inside the BCB film and between this film and the copper substrate were investigated by x-ray photoelectron spectroscopy (XPS). The thickness of that film was measured by optical ellipsometry. Protection of the film vs oxidation and its physical modification during the thermal treatment were also investigated. The XPS valence data showed that a part of the chlorine was linked to the benzene ring while the other part formed either copper chloride or another chloride linked to the nitrogen of the BCB molecule. The passivation film hardened and became an electric insulator during the thermal treatment, so that any successive electrical test was impaired.
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Sirtori, V., Lombardi, L. & Redaelli, G. Chemical composition and thermal stability of 2 butyl, 5 chloro, benzimidazole film. J. Electron. Mater. 26, 459–462 (1997). https://doi.org/10.1007/s11664-997-0119-3
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DOI: https://doi.org/10.1007/s11664-997-0119-3