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Bonding Cu to Al2O3 with Bi-B-Zn Oxide Glass Via Oxidation–Reduction Reaction

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Abstract

Bonding Cu on Al2O3 is a key and difficult technology applied in high-power semiconductor devices. A method proposed in this work investigates bonding with a kind of Bi-B-Zn oxide glass powder paste as a solder. Oxidation–reduction reactions between the Cu plate and the solder took place and generated Bi metal during the joining procedure. With an increase in the joining temperature, the tensile strength increased due to the increase of Bi metal formation. The Bi metal played an important role in joining Cu and Al2O3 because of its much better wettability on Cu than that of the oxides. A compound ZnAl2O4 was observed to form between the Al2O3 ceramic and oxide layer, which strengthened the bond.

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References

  1. W.H. Tuan and S.K. Lee, J. Eur. Ceram. Soc. 34, 4117 (2014).

    Article  Google Scholar 

  2. C.Y. Lin and W.H. Tuan, Int. J. Appl. Ceram. Tec. 13, 170 (2016).

    Article  Google Scholar 

  3. A. Lindemann, G. Strauch, and I.E.E.E. Trans, Power Electron. 22, 7 (2007).

    Google Scholar 

  4. P. Zhang, J. Fang, R. Fu, X. Gu, and M. Fei, Mater. Des. 87, 619 (2015).

    Article  Google Scholar 

  5. M.F. Ashby, J. Phys. IV 3, 9 (1993).

    Google Scholar 

  6. S. Bao, K. Tang, A. Kvithyld, T. Engh, and M. Tangstad, Trans. Nonferrous Met. Soc. China 22, 1930 (2012).

    Article  Google Scholar 

  7. Z. Liu, J. Cai, and Q. Wang, Thin Solid Films 595, 118 (2015).

    Article  Google Scholar 

  8. M. M. Schwartz, Ceramic Joining. (American Society for Metals Press, Metals Park, 1990).

  9. R. Asthana, M. Singh, H.T. Lin, T. Matsunaga, and T. Ishikawa, Int. J. Appl. Ceram. Tec. 10, 801 (2013).

    Article  Google Scholar 

  10. Q. Xu, Y. Mei, X. Li, and G.Q. Lu, J. Alloys Compd. 675, 317 (2016).

    Article  Google Scholar 

  11. G. Va, Am. Ceram. Soc. Bull. 8, 7 (2002).

    Google Scholar 

  12. H. He, R. Fu, D. Wang, X. Song, and M. Jing, Mater. Lett. 61, 4131 (2007).

    Article  Google Scholar 

  13. X. Zhu, C. Mai, M. Li, and J. Non-Cryst, Solids 88, 55 (2014).

    Google Scholar 

  14. E.M. Levin and A.C. McDANlEL, J. Amer. Chem. Soc. 45, 6 (1962).

    Google Scholar 

  15. C. Bastioli, V. Bellotti, L. Del Giudice, and G. Gilli, J. Environ. Poly. Deg. 1, 181 (1993).

    Article  Google Scholar 

  16. P. Fima, W. Gąsior, A. Sypień, and Z. Moser, J. Mate. Sci. 45, 4339 (2010).

    Article  Google Scholar 

Download references

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    Authors and Affiliations

    1. School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen Graduate School, Shenzhen, China

      Jianqiang Chen, Yufeng Li, Weiliang Miao, Chengle Mai & Mingyu Li

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    1. Jianqiang Chen
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    2. Yufeng Li
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    3. Weiliang Miao
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    4. Chengle Mai
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    5. Mingyu Li
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    Correspondence to Mingyu Li.

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    Jianqiang Chen and Yufeng Li have contributed equally to this work.

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    Chen, J., Li, Y., Miao, W. et al. Bonding Cu to Al2O3 with Bi-B-Zn Oxide Glass Via Oxidation–Reduction Reaction. J. Electron. Mater. 47, 542–549 (2018). https://doi.org/10.1007/s11664-017-5783-3

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    • DOI: https://doi.org/10.1007/s11664-017-5783-3

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