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Microstructural Evolution and Migration Mechanism Study in a Eutectic Sn-37Pb Lap Joint Under High Current Density

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Abstract

The microstructural evolution in eutectic Sn-37Pb solder under high current density seriously threatens the reliability of solder interconnections, but atomic electromigration has often been confused with thermomigration. In this paper, after decoupling the effect of the non-uniform temperature distribution in a Cu/Sn-37Pb/Cu lap joint from the current stress, the microstructural evolution was investigated under an average current density of 1.84 × 104 A cm−2 for 0–24 h. The decomposition and recombination of the Pb-rich phase occurred at the cathode and the anode, respectively. The corresponding migration mechanism was proposed from the viewpoint of energy and was explained by the interactions among the potential energies of ripening, electron wind force, and back stress. Our study may be helpful for understanding the migration mechanism and reliability of eutectic two-phase solder joints and provides supporting data for interpreting the acceleration tests of Sn-37Pb solder joints under electromigration.

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Acknowledgements

This work was financially supported by the National Nature Science Foundation of China under Grant No. 51305103, the Young and Middle-aged Scholars Education Research Project of the Education Department of Fujian Province under Grant No. JAT160012, the University Distinguished Young Research Talent Training Program of Fujian Province under Grant No. JAT160835, and the Technology Project of Education Department of Fujian Province under Grant No. JAT160831.

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Authors and Affiliations

  1. Fujian Key Laboratory of Advanced Materials, Department of Materials Science and Engineering, College of Materials, Xiamen University, Xiamen, 361005, China

    Zhihao Zhang, Yuxi Yu & Shun Yao

  2. School of Mechanical and Automation Engineering, Xiamen City University, Xiamen, 361005, China

    Huijun Cao

  3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen, 518055, China

    Haifeng Yang, Yong Xiao & Mingyu Li

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  1. Zhihao Zhang
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  2. Huijun Cao
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  6. Yuxi Yu
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Correspondence to Zhihao Zhang.

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Zhang, Z., Cao, H., Yang, H. et al. Microstructural Evolution and Migration Mechanism Study in a Eutectic Sn-37Pb Lap Joint Under High Current Density. J. Electron. Mater. 46, 5028–5038 (2017). https://doi.org/10.1007/s11664-017-5511-z

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  • DOI: https://doi.org/10.1007/s11664-017-5511-z

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