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Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate

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Abstract

The effects of micro solder joint geometry on intermetallic compound (IMC) growth and electromigration during thermal aging and current stressing have been investigated using three groups of specimens: sandwich structure with solder layer of 10 μm to 50 μm, wire butt with solder layer of 60 μm to 240 μm, and solder ball with diameter of 200 μm to 500 μm, each having Cu/Sn/Cu structure. The results indicated that the geometrical size of the micro solder joint clearly affected the interfacial element diffusion and IMC evolution. Furthermore, when the solder layer thickness was less than 30 μm, the growth rate of the IMC layer decreased significantly with decreasing solder layer thickness, because Sn element was nearly exhausted in the micro solder joint during thermal aging.

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Authors and Affiliations

  1. School of Material Science and Engineering, Harbin University of Science and Technology, 4# Linyuan Road, Harbin, 150040, China

    Fenglian Sun, Yan Zhu & Xuemei Li

  2. School of Material Science and Engineering, Heilongjiang University of Science and Technology, 2468# Puyuan Road, Harbin, 150022, China

    Yan Zhu

Authors
  1. Fenglian Sun
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  2. Yan Zhu
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  3. Xuemei Li
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Correspondence to Fenglian Sun.

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Sun, F., Zhu, Y. & Li, X. Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate. J. Electron. Mater. 46, 4034–4038 (2017). https://doi.org/10.1007/s11664-017-5344-9

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  • DOI: https://doi.org/10.1007/s11664-017-5344-9

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