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Effect of Ag and Pb Addition on Microstructural and Mechanical Properties of SAC 105 Solders

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Abstract

Melting and crystallization processes of lead-free and lead-contaminated alloys in near-equilibrium state were investigated. In addition, the effect of silver content up to 4 wt.% on the microstructure of Sn-Ag-Cu alloys was studied. The volume fraction of β-Sn decreased by half owing to 4 wt.% Ag content. Furthermore, contamination by lead strongly influences the properties of the solidified microstructure. The Pb grains appear as a result of two processes when the Pb content is equal to 0.5 wt.% or higher: Pb phase solidifies in the quaternary eutectic at 176°C, and Pb grains precipitate from the primary β-Sn solid solution grain during a solid state reaction. The freezing range enlarges to 51°C due to 2 wt.% Pb content owing to quaternary eutectic. Above 1 wt.% Pb content, the mechanical properties also improve due to grains of quaternary eutectic Pb and precipitated Pb grains with a size <1 μm.

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Acknowledgements

The research work presented in this paper was based on the results achieved within the TÁMOP-4.2.1.B-10/2/KONV-2010-0001 project and carried out as part of the TÁMOP-4.2.2.A-11/1/KONV-2012-0019 project in the framework of the New Széchenyi Plan. The realization of this project is supported by the European Union, and co-financed by the European Social Fund.

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Authors and Affiliations

  1. Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metalforming and Nanotechnology, University of Miskolc, Miskolc, Hungary

    Aliz Molnar, Ibolya Kardos, Istvan Molnar & Zoltan Gacsi

  2. MTA ME Material Science Research Group, Miskolc, Hungary

    Dora Janovszky

  3. ISD Dunaferr Zrt., Dunaújváros, Hungary

    Ibolya Kardos

Authors
  1. Aliz Molnar
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  2. Dora Janovszky
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  3. Ibolya Kardos
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  4. Istvan Molnar
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  5. Zoltan Gacsi
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Correspondence to Aliz Molnar.

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Molnar, A., Janovszky, D., Kardos, I. et al. Effect of Ag and Pb Addition on Microstructural and Mechanical Properties of SAC 105 Solders. J. Electron. Mater. 44, 3863–3871 (2015). https://doi.org/10.1007/s11664-015-3866-6

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  • DOI: https://doi.org/10.1007/s11664-015-3866-6

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