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A Thermally Conductive Composite with a Silica Gel Matrix and Carbon-Encapsulated Copper Nanoparticles as Filler

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Abstract

Core–shell-structured nanocapsules with a copper core encapsulated in a carbon shell (Cu-C) were synthesized by a direct-current arc-discharge method. Morphological and microstructural characterization showed that the Cu-C consisted of a nanosized Cu core and carbon shell, with the carbon shells containing 6 to 15 ordered graphitic layers and amorphous carbon that effectively shield the metallic Cu core from oxidation. A thermally conductive composite was successfully fabricated using a silica gel matrix incorporated with Cu-C filler. The Cu-C nanoparticles were homogeneously dispersed in the silica gel. The effects of Cu-C on the thermal conductivity, electrical resistivity, and coefficient of thermal expansion (CTE) of the composite were investigated. For composites with 6.16 vol.%, 11.04 vol.%, 16.70 vol.%, and 23.34 vol.% Cu-C content, the thermal conductivity at 50°C was 0.32 W/(m K) to 0.77 W/(m K), the electrical resistivity was 1.98 × 109, 3.48 × 107, 302, and 1 Ω m, respectively, while the CTE at 200°C was 3.79 × 10−4 K−1 to 3.44 × 10−4 K−1. The results reveal that the ordered graphitic shells in the Cu-C increased both the thermal and electrical conduction, but decreased the CTE by preventing the Cu cores from expanding.

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Authors and Affiliations

  1. School of Materials and Energy, Guangdong University of Technology, Guangzhou, 510006, Guangdong, China

    Jin Lin, Haiyan Zhang, Haoqun Hong, Hui Liu & Xiubin Zhang

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  1. Jin Lin
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  2. Haiyan Zhang
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Correspondence to Haiyan Zhang.

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Lin, J., Zhang, H., Hong, H. et al. A Thermally Conductive Composite with a Silica Gel Matrix and Carbon-Encapsulated Copper Nanoparticles as Filler. J. Electron. Mater. 43, 2759–2769 (2014). https://doi.org/10.1007/s11664-014-3159-5

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  • DOI: https://doi.org/10.1007/s11664-014-3159-5

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